Patents by Inventor Peng Jiang De

Peng Jiang De has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8048385
    Abstract: There is provided a sensing chip capable of measuring a refractive index by utilizing a long-range surface plasmon polariton, accurately measuring an accumulative refractive index in a wide range, and more easily enabling sealing for measurement. The present invention relates to the sensing chip which has a thin metal film or a strip-like metal grown on an underlayer, and has a dielectric that limits a refractive index and a dielectric buffer layer on an upper surface and a lower surface of the thin metal film or the strip-like metal. The dielectric buffer layer is attached onto the thin metal film or the strip-like metal. The thin metal film or the strip-like metal and the buffer layer are sandwiched between two dielectric layers. A hole is made in a surface of the upper dielectric layer to serve as a measurement groove.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: November 1, 2011
    Assignees: Rohm Co., Ltd., Tsinghua University
    Inventors: Huang Yi Dong, Rao Yi, Liu Fang, Zhang Wei, Peng Jiang De, Dai Ohnishi, Daisuke Niwa, Atsushi Tazuke, Yoshikatsu Miura
  • Publication number: 20090209028
    Abstract: There is provided a sensing chip capable of measuring a refractive index by utilizing a long-range surface plasmon polariton, accurately measuring an accumulative refractive index in a wide range, and more easily enabling sealing for measurement. The present invention relates to the sensing chip which has a thin metal film or a strip-like metal grown on an underlayer, and has a dielectric that limits a refractive index and a dielectric buffer layer on an upper surface and a lower surface of the thin metal film or the strip-like metal. The dielectric buffer layer is attached onto the thin metal film or the strip-like metal. The thin metal film or the strip-like metal and the buffer layer are sandwiched between two dielectric layers. A hole is made in a surface of the upper dielectric layer to serve as a measurement groove.
    Type: Application
    Filed: December 31, 2008
    Publication date: August 20, 2009
    Applicants: Rohm Co., Ltd., Tsinghua University
    Inventors: Huang Yi Dong, Rao Yi, Liu Fang, Zhang Wei, Peng Jiang De, Dai Ohnishi, Daisuke Niwa, Atsushi Tazuke, Yoshikatsu Miura