Patents by Inventor Peng K. Lim

Peng K. Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermoplastic Resin for Compression Molding
    Publication number: 20240067821
    Abstract: Compounded thermoplastic resin, molding composition, compounded polyamide composition, articles formed from the same, and methods of making the resins/compositions and articles. A compounded thermoplastic resin includes a polyamide composition and a random copolymer composition.
    Type: Application
    Filed: December 16, 2021
    Publication date: February 29, 2024
    Inventors: John Buzinkai, Peng He, Isaac K. Iverson, Charles Richard Langrick, Chee Sern Lim
  • MULTI-LAYER PROTECTIVE CASE FOR HANDHELD DEVICES
    Publication number: 20150374087
    Abstract: The present invention generally relates to a protective case for a handheld device. Specifically, embodiments of the present invention provide for a multi-layer protective case that is formed as a single piece apparatus. Each of the multiple layers provides unique characteristics that add to the look, feel, and protection offered by the case.
    Type: Application
    Filed: February 2, 2015
    Publication date: December 31, 2015
    Inventors: Peng K. Lim, Xinshan Luo