Patents by Inventor Peng Pei

Peng Pei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device and method for simulating and testing slump of backfill material in vertical borehole of closed-loop
    Patent number: 12566117
    Abstract: Disclosed are a device and a method for simulating and testing slump of a backfill material in a vertical borehole of a closed-loop. The device includes a lower pipe body, an upper pipe body, a cushion layer, and a press platen. The lower pipe body and the upper pipe body are coaxial and have the same inner diameter. An upper end of the lower pipe body is provided with a first outer flange, a lower end of the upper pipe body is provided with a second outer flange, and the first outer flange is fixedly connected to the second outer flange. The cushion layer is disposed between the first outer flange and the second outer flange to form a gap between the first outer flange and the second outer flange for simulating a strata fracture.
    Type: Grant
    Filed: July 20, 2023
    Date of Patent: March 3, 2026
    Assignee: Guizhou University
    Inventors: Peng Pei, Yumeng Wang, Yixia Chen, Fengqiang Deng
  • Device and method for simulating and testing slump of backfill material in vertical borehole of closed-loop
    Publication number: 20240385092
    Abstract: Disclosed are a device and a method for simulating and testing slump of a backfill material in a vertical borehole of a closed-loop. The device includes a lower pipe body, an upper pipe body, a cushion layer, and a press platen. The lower pipe body and the upper pipe body are coaxial and have the same inner diameter. An upper end of the lower pipe body is provided with a first outer flange, a lower end of the upper pipe body is provided with a second outer flange, and the first outer flange is fixedly connected to the second outer flange. The cushion layer is disposed between the first outer flange and the second outer flange to form a gap between the first outer flange and the second outer flange for simulating a strata fracture.
    Type: Application
    Filed: July 20, 2023
    Publication date: November 21, 2024
    Inventors: Peng Pei, Yumeng Wang, Yixia Chen, Fengqiang Deng