Abstract: A wavelength conversion device includes a wavelength conversion element, at least one condenser lens, at least one fixing device, a heat dissipation wind flow device, and a wind guide structure. The wavelength conversion element includes a substrate, a wavelength conversion layer, and a driving component. The substrate has a first surface and a second surface opposite to each other. The wavelength conversion layer is disposed on the first surface, and the driving component drives the substrate to rotate about a rotary shaft of the driving component as a central axis. The condenser lens is arranged on one side of the first surface of the wavelength conversion element and fixed to the fixing device. The fixing device has at least one vent. The wind guide structure is connected to the heat dissipation wind flow device and the vent.

Abstract: Sentiment scores are presented within a communication session. In one embodiment, a system extracts, from a transcript, utterances including one or more sentences spoken by the participants. The system identifies a subset of the utterances spoken by a subset of the participants. For each utterance, the system determines a word sentiment score for each word in the utterance, and determines an utterance sentiment score based on the word sentiment scores. The system determines an overall sentiment score for a conversation based on the utterance sentiment scores. The system transmits, to one or more client devices, the overall sentiment score for the conversation.

Abstract: A wavelength conversion module includes a wavelength conversion unit, a support bracket, a lens holder, a condenser lens, and a thermally conductive material. The wavelength conversion unit is disposed on the support bracket. The lens holder is disposed on the support bracket, and has an accommodation space to accommodate the condenser lens. An inner wall of the lens holder is arranged with a bearing surface. The condenser lens has an annular assembly surface. The condenser lens is disposed on the bearing surface through the annular assembly surface to be fixed to the lens holder. The thermally conductive material is disposed between the annular assembly surface of the condenser lens and the bearing surface of the lens holder to transfer heat from the condenser lens to the lens holder.

Abstract: Methods and systems provide for presenting sentiment scores within a communication session. In one embodiment, the system connects to a communication session with a number of participants; receives a transcript of a conversation between the participants produced during the communication session; extracts, from the transcript, utterances including one or more sentences spoken by the participants; identifies a subset of the utterances spoken by a subset of the participants associated with a prespecified organization; for each utterance, determines a word sentiment score for each word in the utterance, and determines an utterance sentiment score based on the word sentiment scores; determines an overall sentiment score for the conversation based on the utterance sentiment scores; and presenting, to one or more client devices, at least the overall sentiment score for the conversation.

Abstract: A projection device includes a housing, and a light source module, an optical engine module, a liquid cooling module, a first fan group and a projection lens disposed in an accommodating space. A light emitting side plate, an air outlet side plate, and a first and a second side plate surround the accommodating space. The air outlet side plate has an air outlet, and at least one of the light emitting side plate, and the first and the second side plate has at least one air inlet. The liquid cooling module includes a heat exchanger. The first fan group is located between the heat exchanger and the air outlet. An orthographic projection area of the cooling fin set of the heat exchanger on the air outlet side plate is smaller than or equal to an orthographic projection area of the first fan group on the air outlet side plate.

Abstract: A heat dissipation module includes an airtight structure and a thermoelectric cooling element. The airtight structure includes a first workpiece, a second workpiece and a compressible element. The first workpiece has a first airtight portion having a plurality of first protrusions. The second workpiece configured in alignment with the first workpiece has a second airtight portion having a plurality of second protrusions. The compressible element is configured between the first airtight portion and the second airtight portion, wherein a part of the compressible element is located in gaps of the first protrusions and gaps of the second protrusions. The thermoelectric cooling element configured between the first workpiece and the second workpiece partially contacts the first workpiece, wherein the heating element is configured on a side of the first workpiece away from the thermoelectric cooling element.

Abstract: A cooling system includes a flow channel structure including flow channel substrates, a first outer substrate, a first inner adsorption layer, a first outer adsorption layer, and a first heat insulating layer and a first cooling chip having a cold side and a hot side opposite to each other. The flow channel substrates surround to form an air flow channel and include a first inner substrate with a second surface facing the air flow channel and a first surface disposed on the cold side. A first surface of the first outer substrate is disposed on the hot side. The first inner adsorption layer is disposed on the second surface of the first inner substrate. The first outer adsorption layer is disposed on a second surface of the first outer substrate. The first heat insulating layer is disposed between the first inner substrate and the first outer substrate.

Abstract: An apparatus, includes a PCB, a semiconductor package that includes a substrate and a stiffener with an opening, and at least one connection component. The stiffener is disposed on a top surface of the PCB. The at least one connection component is configured to connect the PCB to the semiconductor package. The at least one connection component may include another PCB that is disposed on the substrate within the opening of the stiffener and on the PCB. The at least one connection component may include an array of connectors that are disposed on the substrate within the opening of the stiffener, and may include a socket disposed on the PCB. The at least one connection component may include a BGA that is disposed on the substrate within the opening of the stiffener and on the PCB and on a pedestal portion of a surface of the PCB.

Abstract: A semiconductor package includes a substrate, a semiconductor device, and a stiffener. The substrate has a top surface and a bottom surface. The semiconductor device is disposed on the top surface of the substrate. The stiffener is disposed on the bottom surface of the substrate. The stiffener may be disposed on a perimeter portion of the bottom surface of the substrate, and may not be disposed on a central portion of the bottom surface of the substrate. One or more connection components may disposed on the central portion of the bottom surface of the substrate, and a thickness of the stiffener may be greater than or equal to a thickness of the one or more connection components.

Abstract: In some implementations, an apparatus includes a substrate having a top surface and a bottom surface, a first array of connectors on the bottom surface of the substrate, a semiconductor device disposed on the top surface of the substrate, and a stiffener having a connection portion that extends along at least a portion of a side edge of the substrate. A bottom surface of the connection portion may be coplanar with the bottom surface of the substrate. The apparatus may include a second array of connectors on the bottom surface of the connection portion.

Abstract: An inertia braking test system and a control method is provided, wherein the inertia braking test system is composed of an inertia brake test system, a sensor system and a tested object. An actuating device is connected with the inertia brake control device through a ball stud. The actuation function of the inertia brake control device with two degrees of freedom along the front-and-rear direction and the up-and-down direction of the vehicle is realized. The movable chassis realizes the mobile function of the system. The acceleration sensor can sense the acceleration of the movable chassis. Each force is tested by the first force sensor, the second force sensor and the third force sensor. The displacement data is measured by the first displacement sensor and the second displacement sensor, so that a movable brake system test is achieved.

Abstract: An inertia braking test system and a control method is provided, wherein the inertia braking test system is composed of an inertia brake test system, a sensor system and a tested object. An actuating device is connected with the inertia brake control device through a ball stud. The actuation function of the inertia brake control device with two degrees of freedom along the front-and-rear direction and the up-and-down direction of the vehicle is realized. The movable chassis realizes the mobile function of the system. The acceleration sensor can sense the acceleration of the movable chassis. Each force is tested by the first force sensor, the second force sensor and the third force sensor. The displacement data is measured by the first displacement sensor and the second displacement sensor, so that a movable brake system test is achieved.

Abstract: Methods and systems provide for providing intelligent topic segmentation within a communication session. In one embodiment, the system connects to a communication session with a number of participants; receives a transcript of a conversation between the participants produced during the communication session, the transcript including timestamps for a number of utterances associated with speaking participants; shifts a window over the utterances to generate blocks of utterances; for each shift of the window over one utterance, identifies topic model (“TM”) clusters (hereinafter “TM clusters”) and generates TM cluster scores to assign text labels for each cluster; aggregates the scores for the TM clusters to generate a number of utterance level scores; converts the utterance level scores into topic segments each including a start time, end time, and associated text label; and transmits, to one or more client devices, a list of the topic segments for the communication session.

Abstract: The present disclosure relates to three-dimensional target detection methods and apparatuses. One example method includes obtaining an image and point cloud data of a target environment, obtaining semantic information of the image, where the semantic information includes category information corresponding to pixels in the image, and determining three-dimensional location information of a target in the target environment based on the point cloud data, the image, and the semantic information of the image.

Abstract: A heat pump system and a control method thereof. The heat pump system includes a compressor; a reversing valve configured to selectively connect the compressor inlet and the compressor outlet to a first flow path and a second flow path; a heat source-side heat exchanger on the first flow path; a user-side heat exchanger on the second flow path; a first branch and a second branch between the first flow path and the second flow path, the first branch is provided with a first valve and a second valve, and the second branch is provided with a first throttling device and a second throttling device; and an economizer connected between a first position between the first valve and the second valve on the first branch and a second position between the first throttling device and the second throttling device on the second branch.