Patents by Inventor Peng-Ting LEE

Peng-Ting LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230418156
    Abstract: A method of manufacturing a semiconductor device includes forming a photoresist layer including a photoresist composition over a substrate. The photoresist layer is selectively exposed to actinic radiation. The photoresist layer is heated after selectively exposing the photoresist layer to actinic radiation. A gas is flowed over the photoresist layer during the heating the photoresist layer. A flow of the gas is varied during the heating the photoresist layer, and the photoresist layer is developed after the heating the photoresist layer to form a pattern in the photoresist layer.
    Type: Application
    Filed: February 8, 2023
    Publication date: December 28, 2023
    Inventors: Hui-Chun LEE, Tung-Hung FENG, Peng-Ting LEE
  • Publication number: 20210166937
    Abstract: A method of manufacturing a semiconductor device includes forming a photoresist layer including a photoresist composition over a substrate. The photoresist layer is selectively exposed to actinic radiation. The photoresist layer is heated after selectively exposing the photoresist layer to actinic radiation. During the heating, the photoresist layer is exposed to an ambient of greater than 45% relative humidity. The photoresist layer is developed after the heating to form a pattern in the photoresist layer.
    Type: Application
    Filed: November 19, 2020
    Publication date: June 3, 2021
    Inventors: Peng-Ting LEE, Hui-Chun LEE, Jan-Liang YANG