Patents by Inventor Peng Wang Low

Peng Wang Low has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic packages with small footprints and associated methods of manufacturing
    Patent number: 8923004
    Abstract: Several embodiments of stacked-die microelectronic packages with small footprints and associated methods of manufacturing are disclosed herein. In one embodiment, the package includes a substrate, a first die carried by the substrate, and a second die between the first die and the substrate. The first die has a first footprint, and the second die has a second footprint that is smaller than the first footprint of the first die. The package further includes an adhesive having a first portion adjacent to a second portion. The first portion is between the first die and the second die, and the second portion being between the first die and the substrate.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: December 30, 2014
    Assignee: Micron Technology, Inc.
    Inventors: Peng Wang Low, Leng Cher Kuah, Hong Wan Ng, Seng Kim Ye, Chye Lin Toh
  • MICROELECTRONIC PACKAGES WITH SMALL FOOTPRINTS AND ASSOCIATED METHODS OF MANUFACTURING
    Publication number: 20100027233
    Abstract: Several embodiments of stacked-die microelectronic packages with small footprints and associated methods of manufacturing are disclosed herein. In one embodiment, the package includes a substrate, a first die carried by the substrate, and a second die between the first die and the substrate. The first die has a first footprint, and the second die has a second footprint that is smaller than the first footprint of the first die. The package further includes an adhesive having a first portion adjacent to a second portion. The first portion is between the first die and the second die, and the second portion being between the first die and the substrate.
    Type: Application
    Filed: July 31, 2008
    Publication date: February 4, 2010
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Peng Wang Low, Leng Cher Kuah, Hong Wan Ng, Seng Kim Ye, Chye Lin Toh