Abstract: A photoimageable composition for preparing a polymeric binder having of one or more of monomer unit copolymers, a photoactive compound, and one or more organometallic compounds is provided. The copolymers include one or more hydroxyl or carboxyl functional groups that react with the organometallic compound to form a crosslinked network upon curing. The photoimageable compositions may be particularly useful in forming a pixel-defining layer of an electronic device. such as an organic light emitting diode. In particular, photoimageable compositions in accordance with embodiments of the present invention are insoluble in the developer prior to exposure to radiation, soluble in the developer following radiation exposure, and have relatively high glass transition temperatures (Tg) making them useful in forming a pixel-defining layer.

Abstract: Certain polyarylene oligomers having improved solubility are useful in forming dielectric material layers in electronics applications.

Abstract: Compositions of arylene oligomers and certain curing agents are useful to provide arylene polymer coatings having improved mechanical properties when cured in an oxygen-containing atmosphere. Methods of curing such compositions are also provided.

Abstract: Polyarylene oligomers formed from an aromatic dialkyne monomer having a solubility enhancing moiety show improved solubility in certain organic solvents and are useful in forming dielectric material layers in electronics applications.

Abstract: A method of manufacturing a display device is provided which uses a sacrificial layer interposed between a carrier and a display device substrate.

Abstract: Compositions of arylene oligomers and certain curing agents are useful to provide arylene polymer coatings having improved mechanical properties when cured in an oxygen-containing atmosphere. Methods of curing such compositions are also provided.

Abstract: A method of manufacturing a display device is provided which uses a sacrificial layer interposed between a carrier and a display device substrate.

Abstract: Certain polyarylene oligomers having improved solubility are useful in forming dielectric material layers in electronics applications.

Abstract: Methods of treating the surface of a metal-containing hardmask used in the manufacture of semiconductors by contacting the hardmask surface with a composition capable of adjusting the water contact angle so as to substantially match that of subsequently applied organic coatings are provided.

Abstract: Certain polyphenylene oligomers having good solvent strip resistance, low coefficient of thermal expansion and good adhesion to a variety of surfaces are useful as thin-film dielectric materials in electronics applications.

Abstract: Compositions containing certain organometallic oligomers suitable for use as spin-on, metal hardmasks are provided, where such compositions can be tailored to provide a metal oxide hardmask having a range of etch selectivity. Also provided are methods of depositing metal oxide hardmasks using the present compositions.

Abstract: Methods of treating the surface of a metal-containing hardmask used in the manufacture of semiconductors by contacting the hardmask surface with a composition capable of adjusting the water contact angle so as to substantially match that of subsequently applied organic coatings are provided.

Abstract: Compositions containing certain organometallic oligomers suitable for use as spin-on, metal hardmasks are provided, where such compositions can be tailored to provide a metal oxide hardmask having a range of etch selectivity. Also provided are methods of depositing metal oxide hardmasks using the present compositions.

Abstract: The present invention relates to the self-assembly of a spherical-morphology block copolymer into V-shaped grooves of a substrate. Although spherical morphology block copolymers typically form a body-centered cubic system (bcc) sphere array in bulk, the V-shaped grooves promote the formation of a face-centered cubic system (fcc) sphere array that is well ordered. In one embodiment, the (111) planes of the fcc sphere array are parallel to the angled side walls of the V-shaped groove. The (100) plane of the fcc sphere array is parallel to the top surface of the substrate, and may show a square symmetry among adjacent spheres. This square symmetry is unlike the hexagonal symmetry seen in monolayers of spherical domains and is a useful geometry for lithography applications, especially those used in semiconductor applications.

Abstract: Nanolithography and nanoscale device features based on a self-assembled film comprising an ABC triblock terpolymer disposed on a substrate surface are provided. The self-assembled film has a controlled pattern of features over the entire film. Each feature comprises block A, block B, or block C of the ABC triblock terpolymer. One or more blocks (A, B, or C) of the self-assembled film can be transformed by, for example, being removed, to provide a particular pattern geometry for nanolithography.

Abstract: The present invention relates to the self-assembly of a spherical-morphology block copolymer into V-shaped grooves of a substrate. Although spherical morphology block copolymers typically form a body-centered cubic system (bcc) sphere array in bulk, the V-shaped grooves promote the formation of a face-centered cubic system (fcc) sphere array that is well ordered. In one embodiment, the (111) planes of the fcc sphere array are parallel to the angled side walls of the V-shaped groove. The (100) plane of the fcc sphere array is parallel to the top surface of the substrate, and may show a square symmetry among adjacent spheres. This square symmetry is unlike the hexagonal symmetry seen in monolayers of spherical domains and is a useful geometry for lithography applications, especially those used in semiconductor applications.

Abstract: The present invention relates to the self-assembly of a spherical-morphology block copolymer into V-shaped grooves of a substrate. Although spherical morphology block copolymers typically form a body-centered cubic system (bcc) sphere array in bulk, the V-shaped grooves promote the formation of a face-centered cubic system (fcc) sphere array that is well ordered. In one embodiment, the (111) planes of the fcc sphere array are parallel to the angled side walls of the V-shaped groove. The (100) plane of the fcc sphere array is parallel to the top surface of the substrate, and may show a square symmetry among adjacent spheres. This square symmetry is unlike the hexagonal symmetry seen in monolayers of spherical domains and is a useful geometry for lithography applications, especially those used in semiconductor applications.