Abstract: A semiconductor structure includes a substrate, a first silicide, and a second silicide. The substrate has a first epitaxy region in a first transistor of a first conductive type and a second epitaxy region in a second transistor of a second conductive type. The first silicide is on the first epitaxy region, the first silicide comprising a first metal and a second metal, and the second silicide is on the second epitaxy region. A work function of the first silicide is greater than a work function of the second silicide.

Abstract: A semiconductor device and a method of making the same are provided. A method according to the present disclosure includes forming a first type epitaxial layer over a second type source/drain feature of a second type transistor, forming a second type epitaxial layer over a first type source/drain feature of a first type transistor, selectively depositing a first metal over the first type epitaxial layer to form a first metal layer while the first metal is substantially not deposited over the second type epitaxial layer over the first type source/drain feature, and depositing a second metal over the first metal layer and the second type epitaxial layer to form a second metal layer.

Abstract: An adjustable frame fixture aims to hold a printed-circuit board (PCB) to pass over a tin oven to process wave soldering. The fixture includes at least two side frames and at least two fasteners. The two side frames are coupled to form a holding dock. The positions of the two neighboring side frames are adjustable to form an area of different sizes to hold the PCB of different sizes. After the positions of the side frames have been adjusted, the fasteners are used to anchor and couple the side frames.

Abstract: A fixture for supporting a printed-circuit board (PCB) has an outer frame, an inner frame and at least two inner connection members. A production line has at least two conveyor belts. The outer frame has two outer side supports for laying on the conveyor and being movable therewith, the inner frame is used for holding the PCB, and the inner connection members couple the inner frame with the outer frame for adjusting the installation angle of inner frame with the outer frame.

Abstract: An adjustable frame fixture aims to hold a printed-circuit board (PCB) to pass over a tin oven to process wave soldering. The fixture includes at least two side frames and at least two fasteners. The two side frames are coupled to form a holding dock. The positions of the two neighboring side frames are adjustable to form an area of different sizes to hold the PCB of different sizes. After the positions of the side frames have been adjusted, the fasteners are used to anchor and couple the side frames.

Abstract: A new solder bath apparatus applied to the soldering furnace is disclosed herein. The solder bath is used for containing molten solder. And a nozzle base is located in the solder bath to flow molten solder upwards. An enclosing frame with axial horizontal pillars mounted on the two terminal sidewalls thereof is put around the nozzle base. Besides, a nozzle manufactured with two bearing pedestals on two terminal sidewalls responsive to the pillars is put around the enclosing frame. Thus, the nozzle can rotate about the axial pillars for adjusting the outlet direction thereof.

Abstract: An adjustable frame structure for carrying a circuit board of different sizes, includes a frame and at least one movable bar, wherein a plurality of first fasteners and at least a pair of parallel tracks are mounted on the frame, and at least one second fastener and at least two rolling pieces are formed on the at least one movable bar. The rolling pieces roll within the tracks such that the at least one movable bar can smoothly move on the frame to adjust the location of the bar on the frame according to the size of the circuit board.

Abstract: An adjustable nozzle of a stannic furnace comprises a nozzle tank which is mounted at the upper portion of a stannic tank of the stannic furnace, a front backflow stopper and a rear backflow stopper which are respectively mounted at the forward area and the backward area inside the nozzle tank to form an opening of the nozzle such that a liquid tin within the stannic tank passes through the nozzle tank and produces a tin wave at the opening of the nozzle. The feature of the adjustable nozzle lies in that the rear backflow stopper is mounted at the backward area inside the nozzle tank by means of a rear combining means which adjusts the altitude of the rear backflow stopper with an altitudinal opening and fixes the rear backflow stopper by a fixing means so as to control the waveform of the tin wave produced by the nozzle of the stannic furnace.

Abstract: An adjustable nozzle of a stannic furnace comprises a nozzle tank which is mounted at the upper portion of a stannic tank of the stannic furnace, a front backflow stopper and a rear backflow stopper which are respectively mounted at the forward area and the backward area inside the nozzle tank to form an opening of the nozzle such that a liquid tin within the stannic tank passes through the nozzle tank and produces a tin wave at the opening of the nozzle. The feature of the adjustable nozzle lies in that the rear backflow stopper is mounted at the backward area inside the nozzle tank by means of a rear combining means which adjusts the altitude of the rear backflow stopper with an altitudinal opening and fixes the rear backflow stopper by a fixing means so as to control the waveform of the tin wave produced by the nozzle of the stannic furnace.

Abstract: A new solder bath apparatus applied to the soldering furnace is disclosed herein. The solder bath is used for containing molten solder. And a nozzle base is located in the solder bath to flow molten solder upwards. An enclosing frame with axial horizontal pillars mounted on the two terminal sidewalls thereof is put around the nozzle base. Besides, a nozzle manufactured with two bearing pedestals on two terminal sidewalls responsive to the pillars is put around the enclosing frame. Thus, the nozzle can rotate about the axial pillars for adjusting the outlet direction thereof.