Abstract: A semiconductor device and a method of making the same are provided. A method according to the present disclosure includes forming a first type epitaxial layer over a second type source/drain feature of a second type transistor, forming a second type epitaxial layer over a first type source/drain feature of a first type transistor, selectively depositing a first metal over the first type epitaxial layer to form a first metal layer while the first metal is substantially not deposited over the second type epitaxial layer over the first type source/drain feature, and depositing a second metal over the first metal layer and the second type epitaxial layer to form a second metal layer.

Abstract: A method including: storing results of a task in a pipeline executed in a container running in a computing environment; generating a check point for the task; and re-executing the pipeline from the check point for the task reusing the results.

Abstract: A method of manufacturing a light-emitting device, including: providing a substrate structure including a top surface; forming a precursor layer on the top surface; removing a portion of the precursor layer and a portion of the substrate from the top surface to form a base portion and a plurality of protrusions regularly arranged on the base portion; forming a buffer layer on the base portion and the plurality protrusions; and forming a III-V compound cap layer on the buffer layer; wherein one of the plurality of protrusions comprises a first portion and a second portion formed on the first portion; wherein the first portion is integrated with the base portion and has a first material which is the same as that of the base portion; and wherein the buffer layer contacts side surfaces of the plurality of protrusions and a surface of the base portion.

Abstract: The present application relates to the field of semiconductor manufacturing technologies, and in particular to a method and an apparatus for automatically processing wafers. The method for automatically processing the wafers includes the following steps: providing several wafers, wherein the wafers operate on a primary path, and the primary path is a path for forming semiconductor structures on the surfaces of the wafers; determining whether there is a need for detecting defects of the wafers, and if yes, automatically switching an operating path of the wafers to a secondary path; detecting the defects of the wafers in the secondary path; and determining whether the defect detection on the wafers is finished, and if yes, automatically switching the operating path of the wafers to the primary path. The application makes it possible to automatically detect the defects of the wafers with different SWR conditions, thereby improving the automation degree of machines.

Abstract: The structure of a semiconductor device with dual silicide contact structures and a method of fabricating the semiconductor device are disclosed. A method of fabricating the semiconductor device includes forming first and second fin structures on a substrate, forming first and second epitaxial regions on the first and second fin structures, respectively, forming first and second contact openings on the first and second epitaxial regions, respectively, selectively forming an oxide capping layer on exposed surfaces of the second epitaxial region, selectively forming a first metal silicide layer on exposed surfaces of the first epitaxial region, removing the oxide capping layer, and forming first and second conductive regions on the metal silicide layer and on the exposed surfaces of the second epitaxial region, respectively. The first metal silicide layer includes a first metal. The first and second conductive regions includes a second metal different from the first metal.

Abstract: An adjustable frame fixture aims to hold a printed-circuit board (PCB) to pass over a tin oven to process wave soldering. The fixture includes at least two side frames and at least two fasteners. The two side frames are coupled to form a holding dock. The positions of the two neighboring side frames are adjustable to form an area of different sizes to hold the PCB of different sizes. After the positions of the side frames have been adjusted, the fasteners are used to anchor and couple the side frames.

Abstract: A fixture for supporting a printed-circuit board (PCB) has an outer frame, an inner frame and at least two inner connection members. A production line has at least two conveyor belts. The outer frame has two outer side supports for laying on the conveyor and being movable therewith, the inner frame is used for holding the PCB, and the inner connection members couple the inner frame with the outer frame for adjusting the installation angle of inner frame with the outer frame.

Abstract: An adjustable frame fixture aims to hold a printed-circuit board (PCB) to pass over a tin oven to process wave soldering. The fixture includes at least two side frames and at least two fasteners. The two side frames are coupled to form a holding dock. The positions of the two neighboring side frames are adjustable to form an area of different sizes to hold the PCB of different sizes. After the positions of the side frames have been adjusted, the fasteners are used to anchor and couple the side frames.

Abstract: A new solder bath apparatus applied to the soldering furnace is disclosed herein. The solder bath is used for containing molten solder. And a nozzle base is located in the solder bath to flow molten solder upwards. An enclosing frame with axial horizontal pillars mounted on the two terminal sidewalls thereof is put around the nozzle base. Besides, a nozzle manufactured with two bearing pedestals on two terminal sidewalls responsive to the pillars is put around the enclosing frame. Thus, the nozzle can rotate about the axial pillars for adjusting the outlet direction thereof.

Abstract: An adjustable frame structure for carrying a circuit board of different sizes, includes a frame and at least one movable bar, wherein a plurality of first fasteners and at least a pair of parallel tracks are mounted on the frame, and at least one second fastener and at least two rolling pieces are formed on the at least one movable bar. The rolling pieces roll within the tracks such that the at least one movable bar can smoothly move on the frame to adjust the location of the bar on the frame according to the size of the circuit board.

Abstract: An adjustable nozzle of a stannic furnace comprises a nozzle tank which is mounted at the upper portion of a stannic tank of the stannic furnace, a front backflow stopper and a rear backflow stopper which are respectively mounted at the forward area and the backward area inside the nozzle tank to form an opening of the nozzle such that a liquid tin within the stannic tank passes through the nozzle tank and produces a tin wave at the opening of the nozzle. The feature of the adjustable nozzle lies in that the rear backflow stopper is mounted at the backward area inside the nozzle tank by means of a rear combining means which adjusts the altitude of the rear backflow stopper with an altitudinal opening and fixes the rear backflow stopper by a fixing means so as to control the waveform of the tin wave produced by the nozzle of the stannic furnace.

Abstract: An adjustable nozzle of a stannic furnace comprises a nozzle tank which is mounted at the upper portion of a stannic tank of the stannic furnace, a front backflow stopper and a rear backflow stopper which are respectively mounted at the forward area and the backward area inside the nozzle tank to form an opening of the nozzle such that a liquid tin within the stannic tank passes through the nozzle tank and produces a tin wave at the opening of the nozzle. The feature of the adjustable nozzle lies in that the rear backflow stopper is mounted at the backward area inside the nozzle tank by means of a rear combining means which adjusts the altitude of the rear backflow stopper with an altitudinal opening and fixes the rear backflow stopper by a fixing means so as to control the waveform of the tin wave produced by the nozzle of the stannic furnace.

Abstract: A new solder bath apparatus applied to the soldering furnace is disclosed herein. The solder bath is used for containing molten solder. And a nozzle base is located in the solder bath to flow molten solder upwards. An enclosing frame with axial horizontal pillars mounted on the two terminal sidewalls thereof is put around the nozzle base. Besides, a nozzle manufactured with two bearing pedestals on two terminal sidewalls responsive to the pillars is put around the enclosing frame. Thus, the nozzle can rotate about the axial pillars for adjusting the outlet direction thereof.