Abstract: Disclosed are various embodiments of an infrared proximity sensor package comprising an infrared transmitter die, an infrared receiver die, a housing comprising outer sidewalls, a first recess, a second recess and a partitioning divider disposed between the first and second recesses. The transmitter die is positioned in the first recess, the receiver die is positioned within the second recess, and at least the partitioning divider of the housing comprises liquid crystal polymer (LCP) such that infrared light internally-reflected within the housing in the direction of the partitioning divider is substantially attenuated or absorbed by the LCP contained therein.

Abstract: A touch input system includes a light-emitting device, a bent light guide and a light detector. The light-emitting device emits light. The bent light guide receives the light emitted by the light-emitting device and guides the light to travel in a direction across a face of a display screen. The light detector detects the light.

Abstract: A transceiver having a light source die, a photodetector die and a substrate is disclosed. The substrate has a first well in which the light source die is mounted and a second well in which the photodetector die is mounted. The substrate has a reflective surface which blocks light leaving the light source from reaching the photodetector unless the light is reflected by an object external to the transceiver. The reflecting surface of the second well in the substrate is shaped to concentrate light received from outside the transceiver onto the photodetector, and in one aspect of the invention it comprises a non-imaging optical element. The light source is powered by applying a potential between first and second contacts on the light source die. A signal is generated between first and second contacts on the photodetector die in response to illumination of the photodetector die.

Abstract: Disclosed are various embodiments of an infrared proximity sensor package comprising an infrared transmitter die, an infrared receiver die, a housing comprising outer sidewalls, a first recess, a second recess and a partitioning divider disposed between the first and second recesses. The transmitter doe is positioned in the first recess, the receiver die is positioned within the second recess, and at least the partitioning divider of the housing comprises liquid crystal polymer (LCP) such that infrared light internally-reflected within the housing in the direction of the partitioning divider is substantially attenuated or absorbed by the LCP contained therein.

Abstract: A transceiver having a light source die, a photodetector die and a substrate is disclosed. The substrate has a first well in which the light source die is mounted and a second well in which the photodetector die is mounted. The substrate has a reflective surface which blocks light leaving the light source from reaching the photodetector unless the light is reflected by an object external to the transceiver. The reflecting surface of the second well in the substrate is shaped to concentrate light received from outside the transceiver onto the photodetector, and in one aspect of the invention it comprises a non-imaging optical element. The light source is powered by applying a potential between first and second contacts on the light source die. A signal is generated between first and second contacts on the photodetector die in response to illumination of the photodetector die.

Abstract: A remote control (RC) receiver device and an ambient light photosensor (ALPS) device are mounted on a single mounting device (e.g., printed circuit board) such that they are part of a single composite assembly. This reduces the amount of space that is needed in electronic devices that incorporate both RC receiver devices and ALPS devices. In addition, by implementing both devices in a single composite assembly, costs associated with manufacturing, assembly and shipping can be reduced. Because the RC receiver device and the ALPS device operate on light of different wavelengths, the composite assembly includes filtering mechanisms that prevent undesired wavelengths of light from impinging on the photodiode of the RC receiver device and on the photosensor of the ALPS device.

Abstract: An optical communication device having multiple light sources under a single lens. The optical communication device has two light sources. The optical communication device has a lens optically coupled to the two light sources. The lens is shaped to direct light from the two light sources towards an axis of the lens. The optical communication device further has a third light source located below the approximate center of the lens.

Abstract: A bi-curvature lens for diodes in an infrared wireless communication transceiver is disclosed. Devices having such a bi-curvature lens, such as a light emitting device, a light detecting device, and a transceiver are also disclosed. A method for designing such a lens, and a method for fabricating a device having such a lens are also disclosed. The bi-curvature lens disclosed has a bottom hemispherical portion and a top aspherical portion. Light emitting diodes and photo detectors used in conjunction with bi-curvature lenses display symmetrical radiation intensity profiles, in accordance with Infrared Data Association standards and protocols.

Abstract: An electronic device having a first piece, a second piece moveable with respect to the first piece, and a position sensor operable to sense the position of the second piece relative to the first piece. The electronic device is operated in a first mode or a second mode dependent upon the position of the second piece relative to the first piece. Optionally, a proximity sensor is provided to detect the presence of a body in close proximity to the device when the second piece is in an open position relative to the first piece.

Abstract: An optical communication device having multiple light sources under a single lens. The optical communication device has two light sources. The optical communication device has a lens optically coupled to the two light sources. The lens is shaped to direct light from the two light sources towards an axis of the lens. The optical communication device further has a third light source located below the approximate center of the lens.

Abstract: Signal communication structures and methods for making the same are provided. One embodiment of the present invention comprises a signal communication structure. The structure comprises a signal communication element having a signal communication surface, an integrated circuit chip, and a substrate. A surface of the signal communication element other than the signal communication surface is physically coupled to a surface of the integrated circuit chip. In addition, another surface of the integrated circuit chip is communicatively coupled to the substrate. Furthermore, the size of the signal communication surface is greater than the size of the surface of the integrated circuit chip to which the signal communication element is physically coupled.