Patents by Inventor Peng Yi Hsieh

Peng Yi Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250088723
    Abstract: A camera device includes a circuit board, a photosensitive element, a first adhesive layer, a lens assembly, and second adhesive layer. The photosensitive element has a photosensitive region and a non-photosensitive region around the photosensitive region. The first adhesive layer is adhesively fixed to the photosensitive element and the circuit board. The lens assembly includes a base and a lens disposed on the base, and the lens has an optical axis. The base includes a bottom wall and an extension member extending from the bottom wall. A limiting surface of the extension member overlaps the non-photosensitive region in a direction along the optical axis. The second adhesive layer has a positioning block and a limiting block. The positioning block is adhesively fixed to the bottom wall and the circuit board, and the limiting block is adhesively fixed to the limiting surface and the non-photosensitive region.
    Type: Application
    Filed: April 17, 2024
    Publication date: March 13, 2025
    Inventors: Cheng-Hun Yang, Peng-Yi Hsieh
  • Publication number: 20240023245
    Abstract: A circuit board module, including a circuit board body, two camera elements, two board-to-board connectors, and an external circuit board, is provided. The circuit board body includes a surface and at least one groove recessed in the surface. The two camera elements are disposed in the at least one groove and electrically connected to the circuit board body. The two board-to-board connectors are disposed on the circuit board body. The external circuit board includes two connection ports pluggably connected to the two board-to-board connectors, so that the external circuit board is electrically connected to the circuit board body.
    Type: Application
    Filed: February 16, 2023
    Publication date: January 18, 2024
    Applicant: Chicony Electronics Co., Ltd.
    Inventors: Hsueh Hua Wang, Peng Yi Hsieh