Abstract: A semiconductor device includes a substrate. The semiconductor device also includes a semiconductor layer disposed in the substrate. The semiconductor device further includes a first dielectric layer disposed on the semiconductor layer. The semiconductor device includes a second dielectric layer disposed on the first dielectric layer. The semiconductor device also includes a pair of thermopile segments disposed on the second dielectric layer. The first dielectric layer and the second dielectric layer form a chamber.

Abstract: The present application provides an array substrate and a display panel. A connecting area is located between a display area and a fanout area. A plurality of connecting lines and a plurality of coupling lines are located in the connecting area. Overlapping areas between the plurality of connecting lines and the plurality of coupling lines are negatively correlated with resistances of a plurality of fanout lines electrically connected to the plurality of connecting lines.

Abstract: A method and apparatus for group sending service data group by broadcasting a pairing request, pairing with computing devices falling within a range of the short range wireless signal and accepting the pairing request, receiving input service data, generating a service data group sending request according to the service data, sending the service data group sending request to a server, and sending the service data to the server. This service data group sending solution improves the efficiency of computing operations when group sending service data.

Abstract: A method and apparatus for group sending service data group by broadcasting a pairing request, pairing with computing devices falling within a range of the short range wireless signal and accepting the pairing request, receiving input service data, generating a service data group sending request according to the service data, sending the service data group sending request to a server, and sending the service data to the server. This service data group sending solution improves the efficiency of computing operations when group sending service data.

Abstract: A socket has a dark colored outer surface and a specification rolled in the outer surface of the socket and coated with a brighter colored electroplating. The method for the surface treatment of the socket includes rolling the specification in an outer surface of the socket; electroplating the socket with a light colored layer of electroplating; removing the light colored layer of electroplating from the outer surface of the socket except for the specification and coating a dark colored layer on the outer surface of the large section except for the specification. By the surface treatment, the specification is obvious from the dark colored outer surface of the socket.

Abstract: A socket has a dark colored outer surface and a specification is rolled in the outer surface of the socket and coated with a brighter colored electroplating. The method for the surface treatment of the socket includes step of rolling an specification in an outer surface of the socket; step of electroplating the socket with a light colored layer of electroplating; step of removing the light colored layer of electroplating from the outer surface of the socket, and step of coating a dark colored layer on the outer surface of the large section and the specification is not included. By the surface treatment, the specification is obvious from the dart colored outer surface of the socket.