Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a first fin structure. The semiconductor device structure includes a first source/drain structure over the first fin structure. The semiconductor device structure includes a first dielectric layer over the first source/drain structure and the substrate. The semiconductor device structure includes a first conductive contact structure in the first dielectric layer and over the first source/drain structure. The semiconductor device structure includes a second dielectric layer over the first dielectric layer and the first conductive contact structure. The semiconductor device structure includes a first conductive via structure passing through the second dielectric layer and connected to the first conductive contact structure. A first width direction of the first conductive contact structure is substantially parallel to a second width direction of the first conductive via structure.

Abstract: A multi-functional electric fan comprises a U-shaped brace pivotably mounted to motor, a support for supporting the brace, an arcuate guide mechanism hinged to the support, a transmission mechanism having a plurality of gears and an arm secured to a pin through an opening of the guide mechanism, a transverse post, and a vertical post. Thus fan can pivot transversely and longitudinally by the cooperation of posts, gears, pin, and opening at the same time to reciprocally induce air movement in a transverse, longitudinal, wavy, or fixed direction.