Patents by Inventor Pengcheng BIAN

Pengcheng BIAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical polishing solution
    Patent number: 11746257
    Abstract: The present invention discloses a chemical mechanical polishing slurry, the chemical mechanical polishing slurry comprises silica abrasive particles, a corrosion inhibitor, a complexing agent, an oxidizer, and at least one kind of polyacrylic acid anionic surfactant. The polishing slurry of the present invention can decrease the removal rate of tantalum while increasing the removal rate of copper, and reduce copper dishing and dielectric erosion after polish.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: September 5, 2023
    Assignee: Anji Microelectronics (Shanghai) Co., Ltd.
    Inventors: Jian Ma, Jianfen Jing, Junya Yang, Kai Song, Xinyuan Cai, Guohao Wang, Ying Yao, Pengcheng Bian
  • CHEMICAL MECHANICAL POLISHING SOLUTION
    Publication number: 20210139740
    Abstract: The present invention discloses a chemical mechanical polishing slurry, the chemical mechanical polishing slurry comprises silica abrasive particles, a corrosion inhibitor, a complexing agent, an oxidizer, and at least one kind of polyacrylic acid anionic surfactant. The polishing slurry of the present invention can decrease the removal rate of tantalum while increasing the removal rate of copper, and reduce copper dishing and dielectric erosion after polish.
    Type: Application
    Filed: December 26, 2018
    Publication date: May 13, 2021
    Inventors: Jian MA, Jianfen JING, Junya YANG, Kai SONG, Xinyuan CAI, Guohao WANG, Ying YAO, Pengcheng BIAN