Patents by Inventor Pengcheng JI

Pengcheng JI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11930342
    Abstract: An electro-acoustic transducer, comprising a supporting frame, a magnet assembly with an annular yoke surrounding a magnet a diaphragm attached to the front edge of the supporting frame, a voice coil suspended by the diaphragm in a gap formed between the magnet and the annular yoke, the voice coil being axially movable with respect to the magnet, and an annular damper arranged to stabilize the diaphragm. The transducer further comprises a damper holder having a substantially flat annular portion attached to the diaphragm, and a conical wall portion surrounding the voice coil, wherein an inner perimeter of the damper is attached to a rear region of the conical wall portion.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: March 12, 2024
    Assignee: Dolby Laboratories Licensing Corporation
    Inventors: Tiezhong Liu, Pengcheng Ji, Wenjie Gui
  • Publication number: 20230007402
    Abstract: An electro-acoustic transducer, comprising a supporting frame, a magnet assembly with an annular yoke surrounding a magnet a diaphragm attached to the front edge of the supporting frame, a voice coil suspended by the diaphragm in a gap formed between the magnet and the annular yoke, the voice coil being axially movable with respect to the magnet, and an annular damper arranged to stabilize the diaphragm. The transducer further comprises a damper holder having a substantially flat annular portion attached to the diaphragm, and a conical wall portion surrounding the voice coil, wherein an inner perimeter of the damper is attached to a rear region of the conical wall portion.
    Type: Application
    Filed: November 17, 2020
    Publication date: January 5, 2023
    Applicant: Dolby Laboratories Licensing Corporation
    Inventors: Tiezhong Liu, Pengcheng Ji, Wenjie Gui
  • Patent number: 10715907
    Abstract: The present invention discloses a speaker unit, a speaker system, and a method for adjusting a vibration displacement of a vibration diaphragm. The method for adjusting a vibration displacement of a vibration diaphragm comprises: obtaining a vibration displacement of a vibration diaphragm; when the vibration displacement is less than a designed amplitude of the vibration diaphragm, increasing an output voltage output by a smart PA to a vibration voice coil till the vibration displacement is equal to the designed amplitude; when the vibration displacement is equal to the designed amplitude, maintaining the output voltage output by the smart PA to the vibration voice coil to enable the vibration displacement to be equal to the designed amplitude; and when the vibration displacement is greater than the designed amplitude, reducing the output voltage output by the smart PA to the vibration voice coil.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: July 14, 2020
    Assignee: Goertek, Inc.
    Inventors: Pengcheng Ji, Xinfeng Yang
  • Patent number: 10638233
    Abstract: The present invention discloses a speaker module and a sound production device. The module comprises a module shell and a speaker unit mounted in the module shell. The module shell comprises a shell main body and two fixed pole plates connected fixedly on the shell main body. The two fixed pole plates are insulated from each other, and each of the two fixed pole plates has a connecting portion exposed to the outside of the shell main body. A vibration system of the speaker unit is provided with a movable pole plate, and each of the two fixed pole plates together with the movable pole plate form a variable capacitor. The speaker module is configured to output an electrical signal representing a vibration displacement of the vibration system by the connecting portions of the two fixed pole plates.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: April 28, 2020
    Assignee: Goertek, Inc.
    Inventors: Huixian Cao, Xinfeng Yang, Guofu Wang, Shu Jiang, Huaisheng Zhang, Pengcheng Ji
  • Patent number: 10582323
    Abstract: Disclosed are a speaker module housing and a manufacturing method thereof. The speaker module housing comprises an upper housing, a lower housing, an annular connection member and a plate member. The annular connection member comprises a fixing portion and a connection portion. A speaker unit assembling hole is formed in the upper housing. The fixing portion of the annular connection member is fixedly connected with the speaker unit assembling hole. The connection portion of the annular connection member is electrically connected with the plate member.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: March 3, 2020
    Assignee: GOERTEK INC.
    Inventors: Pengcheng Ji, Xinfeng Yang
  • Patent number: 10542344
    Abstract: The present disclosure discloses a loudspeaker module and a manufacturing method thereof. The loudspeaker module comprises an outer casing; the outer casing accommodates a speaker unit; the speaker unit partitions an inner cavity of the whole module into two cavities: a front acoustic cavity and a rear acoustic cavity; the rear acoustic cavity is internally provided with a sound-absorbing material; the rear acoustic cavity is further provided with an isolating structure used for isolating the sound-absorbing material from the speaker unit; the isolating structure partitions the entire rear acoustic cavity into a filling area and a non-filling area; the sound-absorbing material is located in the filling area; the sound-absorbing material is a foaming material; the sound-absorbing material is formed by the foaming of the foaming material and then fills the filling area.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: January 21, 2020
    Assignee: GOERTEK INC.
    Inventors: Xinfeng Yang, Tongyan Xu, Pengcheng Ji
  • Patent number: 10433055
    Abstract: The present invention discloses a speaker system with a moving voice coil. A conductive material layer is disposed on a front cover of the speaker system and constitutes a fixed electrode plate. A vibrating component comprises a flexible circuit board secured to one side of a vibrating diaphragm. A metal layer is disposed in the middle of the flexible circuit board and constitutes a movable electrode plate. The fixed electrode plate is electrically connected to an external circuit by means of an external terminal disposed on a front cover solder pad. The flexible circuit board extends to the outside of the speaker system and is provided with a solder pad electrically connected to the external circuit. A capacitance monitoring chip is disposed in the speaker system and electrically connected to a capacitor.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: October 1, 2019
    Assignee: GOERTEK, INC.
    Inventors: Guodong Zhao, Pengcheng Ji, Xinfeng Yang
  • Patent number: 10397718
    Abstract: A vibration diaphragm and a manufacturing method thereof are provided. The vibration diaphragm comprises an annular support member, a first vibration diaphragm layer and a circuit layer. The first vibration diaphragm layer is fixedly connected to a support body of the annular support member. The circuit layer is positioned on a surface of the first vibration diaphragm layer that is adjacent to a vibrating voice coil and is fixedly connected to the first vibration diaphragm layer and the support body. The circuit layer is provided with a circuit area, a capacitance area, and a capacitance solder pad. The capacitance area is a capacitance electrode plate formed on the first vibration diaphragm layer. The capacitance area is communicated with the capacitance solder pad by means of the circuit area. The solder pad corresponds to the support body. The reliability of capacitance data acquisition is improved.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: August 27, 2019
    Assignee: GOERTEK INC.
    Inventors: Guodong Zhao, Pengcheng Ji, Xinfeng Yang
  • Publication number: 20190208328
    Abstract: The present invention discloses a speaker module and a sound production device. The module comprises a module shell and a speaker unit mounted in the module shell. The module shell comprises a shell main body and two fixed pole plates connected fixedly on the shell main body. The two fixed pole plates are insulated from each other, and each of the two fixed pole plates has a connecting portion exposed to the outside of the shell main body. A vibration system of the speaker unit is provided with a movable pole plate, and each of the two fixed pole plates together with the movable pole plate form a variable capacitor. The speaker module is configured to output an electrical signal representing a vibration displacement of the vibration system by the connecting portions of the two fixed pole plates.
    Type: Application
    Filed: February 10, 2017
    Publication date: July 4, 2019
    Inventors: Huixian Cao, Xinfeng Yang, Guofu Wang, Shu Jiang, Huaisheng Zhang, Pengcheng Ji
  • Patent number: 10299033
    Abstract: The present disclosure discloses a loudspeaker module and relates to the technical field of electroacoustic products. The loudspeaker module comprises an outer casing; the outer casing accommodates a speaker unit; the speaker unit comprises a vibration system and a magnetic circuit system; the speaker unit partitions an inner cavity of the whole module into two cavities: a front acoustic cavity and a rear acoustic cavity; the rear acoustic cavity is internally provided with a sound-absorbing material; the rear acoustic cavity is further provided with an isolating structure used for isolating the sound-absorbing material from the speaker unit; the isolating structure partitions the entire rear acoustic cavity into a filling area and a non-filling area; the sound-absorbing material is located in the filling area; the sound-absorbing material is a foaming material; the sound-absorbing material is formed by the foaming of the foaming material and then fills the filling area.
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: May 21, 2019
    Assignee: GOERTEK INC.
    Inventors: Xinfeng Yang, Tongyan Xu, Pengcheng Ji
  • Publication number: 20190098422
    Abstract: The present invention discloses a speaker module housing and a manufacturing method thereof. The speaker module housing comprises an upper housing, a lower housing, an annular connection member and a plate member. The annular connection member comprises a fixing portion and a connection portion. A speaker unit assembling hole is formed in the upper housing. The fixing portion of the annular connection member is fixedly connected with the speaker unit assembling hole. The connection portion of the annular connection member is electrically connected with the plate member. In the speaker module housing provided by the present invention, by fixedly connecting the annular connection member at the speaker unit assembling hole of the upper housing, it is ensured that all components of the speaker unit are assembled in the upper housing through the speaker unit assembling hole.
    Type: Application
    Filed: May 17, 2016
    Publication date: March 28, 2019
    Inventors: Pengcheng JI, Xinfeng YANG
  • Publication number: 20190075416
    Abstract: A vibration diaphragm and a manufacturing method thereof are provided. The vibration diaphragm comprises an annular support member, a first vibration diaphragm layer and a circuit layer. The first vibration diaphragm layer is fixedly connected to a support body of the annular support member. The circuit layer is positioned on a surface of the first vibration diaphragm layer that is adjacent to a vibrating voice coil and is fixedly connected to the first vibration diaphragm layer and the support body. The circuit layer is provided with a circuit area, a capacitance area, and a capacitance solder pad. The capacitance area is a capacitance electrode plate formed on the first vibration diaphragm layer. The capacitance area is communicated with the capacitance solder pad by means of the circuit area. The solder pad corresponds to the support body. The reliability of capacitance data acquisition is improved.
    Type: Application
    Filed: May 24, 2016
    Publication date: March 7, 2019
    Applicant: GOERTEK INC
    Inventors: Guodong ZHAO, Pengcheng JI, Xinfeng YANG
  • Publication number: 20190037304
    Abstract: The present invention discloses a speaker unit, a speaker system, and a method for adjusting a vibration displacement of a vibration diaphragm. The method for adjusting a vibration displacement of a vibration diaphragm comprises: obtaining a vibration displacement of a vibration diaphragm; when the vibration displacement is less than a designed amplitude of the vibration diaphragm, increasing an output voltage output by a smart PA to a vibration voice coil till the vibration displacement is equal to the designed amplitude; when the vibration displacement is equal to the designed amplitude, maintaining the output voltage output by the smart PA to the vibration voice coil to enable the vibration displacement to be equal to the designed amplitude; and when the vibration displacement is greater than the designed amplitude, reducing the output voltage output by the smart PA to the vibration voice coil.
    Type: Application
    Filed: September 21, 2018
    Publication date: January 31, 2019
    Inventors: Pengcheng Ji, Xinfeng Yang
  • Publication number: 20190028804
    Abstract: The present invention discloses a speaker system with a moving voice coil. A conductive material layer is disposed on a front cover of the speaker system and constitutes a fixed electrode plate. A vibrating component comprises a flexible circuit board secured to one side of a vibrating diaphragm. A metal layer is disposed in the middle of the flexible circuit board and constitutes a movable electrode plate. The fixed electrode plate is electrically connected to an external circuit by means of an external terminal disposed on a front cover solder pad. The flexible circuit board extends to the outside of the speaker system and is provided with a solder pad electrically connected to the external circuit. A capacitance monitoring chip is disposed in the speaker system and electrically connected to a capacitor.
    Type: Application
    Filed: September 21, 2018
    Publication date: January 24, 2019
    Inventors: Guodong Zhao, Pengcheng Ji, Xinfeng Yang
  • Publication number: 20180115819
    Abstract: The present disclosure discloses a loudspeaker module and a manufacturing method thereof. The loudspeaker module comprises an outer casing; the outer casing accommodates a speaker unit; the speaker unit partitions an inner cavity of the whole module into two cavities: a front acoustic cavity and a rear acoustic cavity; the rear acoustic cavity is internally provided with a sound-absorbing material; the rear acoustic cavity is further provided with an isolating structure used for isolating the sound-absorbing material from the speaker unit; the isolating structure partitions the entire rear acoustic cavity into a filling area and a non-filling area; the sound-absorbing material is located in the filling area; the sound-absorbing material is a foaming material; the sound-absorbing material is formed by the foaming of the foaming material and then fills the filling area.
    Type: Application
    Filed: December 21, 2017
    Publication date: April 26, 2018
    Inventors: Xinfeng YANG, Tongyan XU, Pengcheng JI
  • Publication number: 20170289672
    Abstract: Disclosed is a speaker module comprising a housing in which a speaker unit is accommodated; the interior cavity of the module is divided into a front acoustic cavity and a rear acoustic cavity by the speaker unit; a sound absorbing material is provided in the rear acoustic cavity; the rear acoustic cavity is provided with a partition member for isolating the sound absorbing material and the speaker unit; the entire rear acoustic cavity is divided into a filled region and a non-filled region by the partition member; the sound absorbing material is located in the filled region; the material of the sound absorbing material is foaming material; and the sound absorbing material is formed by foaming the foaming material and fills the filled region. The speaker module provided by the present invention has good acoustic performance, high production efficiency, low production costs and good uniformity of product.
    Type: Application
    Filed: November 5, 2014
    Publication date: October 5, 2017
    Inventors: Xinfeng YANG, Tongyan XU, Pengcheng JI
  • Publication number: 20170208386
    Abstract: The present disclosure discloses a loudspeaker module and relates to the technical field of electroacoustic products. The loudspeaker module comprises an outer casing; the outer casing accommodates a speaker unit; the speaker unit comprises a vibration system and a magnetic circuit system; the speaker unit partitions an inner cavity of the whole module into two cavities: a front acoustic cavity and a rear acoustic cavity; the rear acoustic cavity is internally provided with a sound-absorbing material; the rear acoustic cavity is further provided with an isolating structure used for isolating the sound-absorbing material from the speaker unit; the isolating structure partitions the entire rear acoustic cavity into a filling area and a non-filling area; the sound-absorbing material is located in the filling area; the sound-absorbing material is a foaming material; the sound-absorbing material is formed by the foaming of the foaming material and then fills the filling area.
    Type: Application
    Filed: June 30, 2015
    Publication date: July 20, 2017
    Inventors: Xinfeng YANG, Tongyan XU, Pengcheng JI