Patents by Inventor PENG-CHENG WU

PENG-CHENG WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical connector with multilayer surface treatment and method for fabricating the same
    Patent number: 8764484
    Abstract: An electrical connector includes an insulative housing (3), a number of contacts (4) retained in the insulative housing (3) and a metallic shell (1) enclosing the insulative housing (3). The metallic shell (1) includes a number of peripheral walls and a soldering tab (15) extending therefrom. Each of the soldering tab (15) and the peripheral walls includes an intermediate layer (20), a first plating layer (21), a second plating layer (22) and a third plating layer (23). The third plating layer (23) covers both inner and outer sides of the second plating layer (22) of the peripheral walls for enhancing anti-wear properties while leaving the second plating layer (22) of the soldering tab (15) uncoated for wetting. Besides, a method of surface treatment of the metallic shell (1) is also disclosed.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: July 1, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Wei-De Zhang, Peng-Cheng Wu
  • ELECTRICAL CONNECTOR WITH MULTILAYER SURFACE TREATMENT AND METHOD FOR FABRICATING THE SAME
    Publication number: 20130164982
    Abstract: An electrical connector includes an insulative housing (3), a number of contacts (4) retained in the insulative housing (3) and a metallic shell (1) enclosing the insulative housing (3). The metallic shell (1) includes a number of peripheral walls and a soldering tab (15) extending therefrom. Each of the soldering tab (15) and the peripheral walls includes an intermediate layer (20), a first plating layer (21), a second plating layer (22) and a third plating layer (23). The third plating layer (23) covers both inner and outer sides of the second plating layer (22) of the peripheral walls for enhancing anti-wear properties while leaving the second plating layer (22) of the soldering tab (15) uncoated for wetting. Besides, a method of surface treatment of the metallic shell (1) is also disclosed.
    Type: Application
    Filed: July 31, 2012
    Publication date: June 27, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: WEI-DE ZHANG, PENG-CHENG WU