Patents by Inventor Pengcheng XIE
Pengcheng XIE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11947821Abstract: The present disclosure provides methods, systems, and non-transitory computer readable media for managing a primary storage unit of an accelerator. The methods include assessing activity of the accelerator; assigning, based on the assessed activity of the accelerator, a lease to a group of one or more pages of data on the primary storage unit, wherein the assigned lease indicates a lease duration; and marking, in response to the expiration of the lease duration indicated by the lease, the group of one or more pages of data as an eviction candidate.Type: GrantFiled: June 15, 2020Date of Patent: April 2, 2024Assignee: Alibaba Group Holding LimitedInventors: Yongbin Gu, Pengcheng Li, Tao Zhang, Yuan Xie
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Patent number: 11772313Abstract: An injection molding adaptive compensation method based on melt viscosity fluctuation comprising: initializing equipment; in a pre-calculation stage, introducing melt into a mold cavity at a constant rate, collecting pre-calculation parameters in each sampling period T, and obtaining a first injection work in the pre-calculation stage by using a first calculation formula; in a self-adaptation stage, introducing the melt into the mold cavity at a constant rate, collecting adaptive parameters in each sampling period T, and obtaining a second injection work in the self-adaptation stage by using a second calculation formula; calling the PVT characteristics of current processing raw materials to construct a PVT relation function, and obtaining an optimized V/P switching point by using a PVT weight control model; and according to the injection work at the pre-calculation stage and the injection work at the present stage, obtaining an optimized holding pressure according to an injection work adjustment model.Type: GrantFiled: June 30, 2020Date of Patent: October 3, 2023Assignee: HAITIAN PLASTICS MACHINERY GROUP CO., LTDInventors: Pengcheng Xie, Nanhong Fu, Jinling Wang, Yuxuan Xu, Xiaolong Jiao, Kaifang Dang, Wei Wu, Zhifeng Ying, Minwen Xia
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Publication number: 20230229528Abstract: This application provides a parameter configuration method, including: receiving a configuration parameter of a service system and a service objective of the service system through a standard interface, performing parameter optimization on the configuration parameter to obtain a recommended parameter value that meets the service objective, and then outputting the recommended parameter value, to implement parameter configuration for the service system. The method abstracts parameter configuration problems in different service scenarios into a mathematical problem of inputting and expression through a standard interface. In this way, a universal parameter configuration method is provided, without case-by-case parameter configuration. In addition, an expert in the service field can independently complete parameter configuration without artificial intelligence experience, thereby improving configuration efficiency and reducing configuration costs.Type: ApplicationFiled: March 27, 2023Publication date: July 20, 2023Inventors: Tao Sun, Pengcheng Xie, Tuo Ai, Xiaosong Lei
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Patent number: 11235502Abstract: Provided is a mold carrier. The mold carrier comprises a mold bearing chassis, a pressure bearing plate, and a tie bar. The mold bearing chassis includes a plurality of molds disposed therein. Each mold has one or more mold cavities. The pressure bearing plate is configured to physically couple to the mold bearing chassis during an injection molding process. The tie bar runs through the center of the mold bearing chassis and the pressure bearing plate. The mold bearing chassis is configured to allow components to be removed from their molds without separating the mold bearing chassis from the pressure bearing plate.Type: GrantFiled: May 20, 2019Date of Patent: February 1, 2022Assignee: International Business Machines CorporationInventors: Pengcheng Xie, Rui Ma, Qiuyi Yu, XiYuan Yin, Qiuying Wang
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Publication number: 20220024099Abstract: An injection molding adaptive compensation method based on melt viscosity fluctuation comprising: initializing equipment; in a pre-calculation stage, introducing melt into a mold cavity at a constant rate, collecting pre-calculation parameters in each sampling period T, and obtaining a first injection work in the pre-calculation stage by using a first calculation formula; in a self-adaptation stage, introducing the melt into the mold cavity at a constant rate, collecting adaptive parameters in each sampling period T, and obtaining a second injection work in the self-adaptation stage by using a second calculation formula; calling the PVT characteristics of current processing raw materials to construct a PVT relation function, and obtaining an optimized V/P switching point by using a PVT weight control model; and according to the injection work at the pre-calculation stage and the injection work at the present stage, obtaining an optimized holding pressure according to an injection work adjustment model.Type: ApplicationFiled: June 30, 2020Publication date: January 27, 2022Inventors: Pengcheng XIE, Nanhong FU, Jinling WANG, Yuxuan XU, Xiaolong JIAO, Kaifang DANG, Wei WU, Zhifeng YING, Minwen XIA
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Patent number: 11050208Abstract: A compliant pin pre-screening, guiding and quality monitoring apparatus is provided. The compliant pin pre-screening, guiding and quality monitoring apparatus includes a fixed plate, a movable plate, a printed circuit board (PCB) and a press-fit connector. The fixed plate defines a through-hole and is disposable above a working table. The movable plate is disposable to be urged by a bias against a first surface of the fixed plate facing the working table and includes pin extendable through the through-hole. The PCB defines a via and is disposable on a second surface of the fixed plate opposite the first surface whereby the pin is extendable through the via with the via corresponding in position to the through-hole and the pin. The press-fit connector is disposable to be secured in position proximate to the PCB and to be inserted into the via with guidance provided by the pin against the bias.Type: GrantFiled: October 31, 2018Date of Patent: June 29, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Qiuyi Yu, Zhongfeng Yang, Rui Ma, Xiyuan Yin, Zhiying Fan, Tao Song, Jun Hu, Pengcheng Xie
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Publication number: 20210091493Abstract: A socket for a card-edge connector comprises a bottom frame end, a top frame end, a first frame portion, a second frame portion, and a slot. A card-edge connector inserted into the slot may proceed from the from the top frame end towards the bottom frame end between the first frame portion and second frame portion. The socket may comprise a pin contact in the first frame portion. The pin contact may comprise a bottom pin that protrudes out of the first frame portion into the slot near the bottom frame end, a pin shaft located within the first frame portion and connected to the bottom pin section, and a top pin section connected to the pin shaft and located within the first frame portion. The socket may comprise a pin fulcrum located within the first frame portion. The pin fulcrum may contact the pin shaft at a fulcrum point.Type: ApplicationFiled: September 25, 2019Publication date: March 25, 2021Inventors: XiYuan Yin, Qiuyi Yu, Zhongfeng Yang, Tao Song, Pengcheng Xie
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Publication number: 20200368954Abstract: Provided is a mold carrier. The mold carrier comprises a mold bearing chassis, a pressure bearing plate, and a tie bar. The mold bearing chassis includes a plurality of molds disposed therein. Each mold has one or more mold cavities. The pressure bearing plate is configured to physically couple to the mold bearing chassis during an injection molding process. The tie bar runs through the center of the mold bearing chassis and the pressure bearing plate. The mold bearing chassis is configured to allow components to be removed from their molds without separating the mold bearing chassis from the pressure bearing plate.Type: ApplicationFiled: May 20, 2019Publication date: November 26, 2020Inventors: Pengcheng Xie, Rui Ma, Qiuyi Yu, XiYuan Yin, Qiuying Wang
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Publication number: 20200198233Abstract: A 3D printing technology-based processing apparatus and method includes a frame, an injection unit, and a molding unit. A melted polymer filler can be filled into a blind hole or a passageway of a 3D printed product to improve overall strength of the product. A 3D printed product having a mortise and tenon shaped mechanical engagement structure is disclosed. The printed product having the mortise and tenon shaped structure has higher tensile strength and shear strength. The present apparatus effectively resolves a problem of warped and deformed products due to an excessive temperature difference between the product and an environment during printing. The method uses an optimized printing process to reduce the fabrication processes of a support structure, reduce consumables required for building the structure, and improve the printed surface quality of the printed product.Type: ApplicationFiled: March 21, 2019Publication date: June 25, 2020Inventors: Weimin YANG, Zhiwei JIAO, Pengcheng XIE, Jing TAN, Haoyi LI, Ying AN, Hua YAN, Lisheng CHENG, Yumei DING, Haopeng MA, Xiulei WANG, Rongjun LI, Chaoqun LIAO
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Publication number: 20200136333Abstract: A compliant pin pre-screening, guiding and quality monitoring apparatus is provided. The compliant pin pre-screening, guiding and quality monitoring apparatus includes a fixed plate, a movable plate, a printed circuit board (PCB) and a press-fit connector. The fixed plate defines a through-hole and is disposable above a working table. The movable plate is disposable to be urged by a bias against a first surface of the fixed plate facing the working table and includes pin extendable through the through-hole. The PCB defines a via and is disposable on a second surface of the fixed plate opposite the first surface whereby the pin is extendable through the via with the via corresponding in position to the through-hole and the pin. The press-fit connector is disposable to be secured in position proximate to the PCB and to be inserted into the via with guidance provided by the pin against the bias.Type: ApplicationFiled: October 31, 2018Publication date: April 30, 2020Inventors: QIUYI YU, ZHONGFENG YANG, RUI MA, XIYUAN YIN, ZHIYING FAN, TAO SONG, JUN HU, PENGCHENG XIE
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Patent number: 10392141Abstract: A bag forming device and a bag machine are provided. The bag forming device comprises at least two bag forming units, wherein each bag forming unit comprises a deflection element and a folding element, and the forming tubes of the folding elements are arranged in a first direction in sequence. The packaging film is moved in a moving route when moving through the deflection element, and film moving positions are provided in the deflection element in the moving route for passing through of the packaging film to make deflection of the packaging film. The present invention reasonably adjusts the moving direction of the packaging films, and the direction of the longitudinal openings of the packaging films after longitudinal folding.Type: GrantFiled: November 4, 2013Date of Patent: August 27, 2019Assignee: DONGGUAN FOISON PACKING MACHINERY CO., LTD.Inventors: Wanpeng Xie, Libo Su, Pengcheng Xie
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Patent number: 10344400Abstract: A melt differential electrospinning device and process, the melt differential electrospinning device comprising a spinning nozzle (1), a fiber receiving device (3), a first high-voltage electrostatic generator (6), a second high-voltage electrostatic generator (7), a grounding electrode (5), and n layers of electrode plates of a first electrode plate (2) and a second electrode plate (4), n being an integer greater than or equal to 2; the spinning nozzle comprises a splitter plate (21), a nut (22), a spring spacer (23), an air pipe positioning pin (24), a screw (25), a nozzle body positioning pin (26), a nozzle body (27), an air pipe (28), a heating device (29), a temperature sensor (210) and an inner cone nozzle (211).Type: GrantFiled: April 28, 2014Date of Patent: July 9, 2019Assignee: Beijing University of Chemical TechnologyInventors: Weimin Yang, Haoyi Li, Zhiwei Jiao, Xiangfeng Zhong, Hua Yan, Pengcheng Xie, Ying An, Yumei Ding, Jing Tan, Hongbo Chen
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Publication number: 20160068999Abstract: A melt differential electrospinning device and process, the melt differential electrospinning device comprising a spinning nozzle (1), a fiber receiving device (3), a first high-voltage electrostatic generator (6), a second high-voltage electrostatic generator (7), a grounding electrode (5), and n layers of electrode plates of a first electrode plate (2) and a second electrode plate (4), n being an integer greater than or equal to 2; the spinning nozzle comprises a splitter plate (21), a nut (22), a spring spacer (23), an air pipe positioning pin (24), a screw (25), a nozzle body positioning pin (26), a nozzle body (27), an air pipe (28), a heating device (29), a temperature sensor (210) and an inner cone nozzle (211).Type: ApplicationFiled: April 28, 2014Publication date: March 10, 2016Inventors: Weimin Yang, Haoyi Li, Zhiwei Jiao, Xiangfeng Zhong, Hua Yan, Pengcheng Xie, Ying An, Yumei Ding, Jing Tan, Hongbo Chen
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Publication number: 20160023789Abstract: A bag forming device and a bag machine are provided. The bag forming device comprises at least two bag forming unit, wherein each bag forming unit comprises a deflection element and a folding element, and the forming tubes of the folding elements are arranged in a first direction in sequence. The packaging film is moved in a moving route when moving through the deflection element, and film moving positions are provided in the deflection element in the moving route for passing through of the packaging film to make deflection of the packaging film. The present invention reasonably adjusts the moving direction of the packaging films, and the direction of the longitudinal openings of the packaging films after longitudinal folding.Type: ApplicationFiled: November 4, 2013Publication date: January 28, 2016Applicant: GUANGZHOU YILUGAO PACKING MACHINERY TECHNIC CO., LTDInventors: Wanpeng XIE, Libo SU, Pengcheng XIE