Patents by Inventor Pengfei CHUI

Pengfei CHUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250092494
    Abstract: Provided are a high-plasticity dual-phase high-entropy alloy (HEA) and a preparation method thereof. The high-plasticity dual-phase HEA has a chemical formula as shown in Formula I: (FeCoNiCr)100-xTix (Formula I), in which, x is in a range of 2.0 to 2.8. A method for preparing the high-plasticity dual-phase HEA is also provided.
    Type: Application
    Filed: July 13, 2023
    Publication date: March 20, 2025
    Applicant: SHAANXI UNIVERSITY OF TECHNOLOGY
    Inventors: Ran JING, Xiong ZHANG, Qing ZHANG, Taotao AI, Jianghua LI, Pengfei CHUI, Yang ZHANG, Zhongni LIAO
  • Publication number: 20240295013
    Abstract: The present disclosure provides a high-entropy alloy (HEA) with room-temperature superplasticity and a preparation method thereof, belonging to the field of metal materials. In the present disclosure, the HEA with room-temperature superplasticity has a chemical formula shown in Formula I: (FeCoNiCr)100-xCux (Formula I), where in Formula I, x is 2.0 to 4.0. A FeCoNiCr alloy is used as a matrix, and then added with a trace amount of a Cu element, thereby significantly reducing formation of a metastable phase in the FeCoNiCr alloy while reducing stacking fault energy of the alloy, such that the alloy maintains a desirable work hardening ability and achieves an excellent elongation at break. Moreover, a plasticity of the alloy is further improved through twinning-induced plasticity (TWIP).
    Type: Application
    Filed: January 26, 2024
    Publication date: September 5, 2024
    Applicant: Shaanxi University of Technology
    Inventors: Ran JING, Xiong ZHANG, Qing ZHANG, Taotao AI, Jianghua LI, Pengfei CHUI, Yang ZHANG, Zhongni LIAO