Patents by Inventor Penghua GE

Penghua GE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-strength and tough multi-component soft magnetic alloy and preparation method thereof
    Patent number: 12291763
    Abstract: A high-strength and tough multi-component soft magnetic alloy and preparation method thereof are provided. The high-strength and tough multi-component soft magnetic alloy is composed of the following components in atomic percentage: Fe 32-45%, Co 24-29%, Ni 24-29%, Al 2.5-8%, Ti 1.5-3.5%, Ta 1.0-5%, Nb 0-2%, and Mo 0-2%. The multi-component alloys prepared by the present invention exhibit a face-centered cubic structure of the matrix, featured with high strength, high ductility, low coercivity and relatively high saturation magnetization. These properties make it suitable for manufacturing critical components for applications in industries such as electrical engineering, automatic control, mobile communications, and others.
    Type: Grant
    Filed: July 10, 2023
    Date of Patent: May 6, 2025
    Assignee: Central South University
    Inventors: Zhiming Li, Penghua Ge, Dingshun Yan, Kefu Gan, Yong Zhang
  • HIGH-STRENGTH AND TOUGH MULTI-COMPONENT SOFT MAGNETIC ALLOY AND PREPARATION METHOD THEREOF
    Publication number: 20240327959
    Abstract: A high-strength and tough multi-component soft magnetic alloy and preparation method thereof are provided. The high-strength and tough multi-component soft magnetic alloy is composed of the following components in atomic percentage: Fe 32-45%, Co 24-29%, Ni 24-29%, Al 2.5-8%, Ti 1.5-3.5%, Ta 1.0-5%, Nb 0-2%, and Mo 0-2%. The multi-component alloys prepared by the present invention exhibit a face-centered cubic structure of the matrix, featured with high strength, high ductility, low coercivity and relatively high saturation magnetization. These properties make it suitable for manufacturing critical components for applications in industries such as electrical engineering, automatic control, mobile communications, and others.
    Type: Application
    Filed: July 10, 2023
    Publication date: October 3, 2024
    Inventors: Zhiming LI, Penghua GE, Dingshun YAN, Kefu GAN, Yong ZHANG