Patents by Inventor Pengju LV

Pengju LV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10818447
    Abstract: A preparation method of a rapid bonding of a long silver-graphite electrical contact material and a solder strip material includes the following steps: first step, making a silver-graphite spindle into a silver-graphite electrical contact sheet material by an extrusion process; second step, performing a sintering to composite a solder strip material with the silver-graphite electrical contact sheet material to obtain a composite blank; and third step, performing a rolling and a heat treatment on the composite blank for one or more times to complete the composite of the long silver-graphite electrical contact material and the solder strip material. The method is a method for preparing a silver-based electrical contact material and solder composite material.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: October 27, 2020
    Assignee: WENZHOU HONGFENG ELECTRICAL ALLOY CO., LTD
    Inventors: Xiao Chen, Xinhe Wu, Chengfa Mu, Kaixu Wang, Pengju Lv
  • Publication number: 20200294734
    Abstract: A preparation method of a rapid bonding of a long silver-graphite electrical contact material and a solder strip material includes the following steps: first step, making a silver-graphite spindle into a silver-graphite electrical contact sheet material by an extrusion process; second step, performing a sintering to composite a solder strip material with the silver-graphite electrical contact sheet material to obtain a composite blank; and third step, performing a rolling and a heat treatment on the composite blank for one or more times to complete the composite of the long silver-graphite electrical contact material and the solder strip material. The method is a method for preparing a silver-based electrical contact material and solder composite material.
    Type: Application
    Filed: November 14, 2018
    Publication date: September 17, 2020
    Applicant: WENZHOU HONGFENG ELECTRICAL ALLOY CO., LTD
    Inventors: Xiao CHEN, Xinhe WU, Chengfa MU, Kaixu WANG, Pengju LV