Abstract: A case heat dissipation structure is provided, which includes a case, a heat exchange assembly and a fan assembly. The case has a first heat dissipation chamber and a second heat dissipation chamber that are communicated with each other, and multiple heat sources are mounted in the first heat dissipation chamber and the second heat dissipation chamber, a liquid inlet for cooling liquid to flow in and a liquid outlet for cooling liquid to flow out are provided on the case. The heat exchange assembly is mounted in the first heat dissipation chamber, the heat exchange assembly comprises a heat exchanger, which is arranged between the liquid inlet and the liquid outlet. The fan assembly is mounted in the first heat dissipation chamber or the second heat dissipation chamber, and is used for driving the air in the first heat dissipation chamber and the second heat dissipation chamber to circulate mutually in operation.

Abstract: A case heat dissipation structure is provided, which includes a case, a heat exchange assembly and a fan assembly. The case has a first heat dissipation chamber and a second heat dissipation chamber that are communicated with each other, and multiple heat sources are mounted in the first heat dissipation chamber and the second heat dissipation chamber, a liquid inlet for cooling liquid to flow in and a liquid outlet for cooling liquid to flow out are provided on the case. The heat exchange assembly is mounted in the first heat dissipation chamber, the heat exchange assembly comprises a heat exchanger, which is arranged between the liquid inlet and the liquid outlet. The fan assembly is mounted in the first heat dissipation chamber or the second heat dissipation chamber, and is used for driving the air in the first heat dissipation chamber and the second heat dissipation chamber to circulate mutually in operation.

Abstract: A heat dissipation device of an inverter is provided disclosed by the present application, which includes a heat sink base, a cooling module and a temperature equalizing plate arranged on the heat sink base. The cooling module is configured to dissipate heat from the heat sink base, the temperature equalizing plate is provided with a part mounting seat, and the heat sink base is arranged between the cooling module and the temperature equalizing plate. When in use, the heat sink base is mounted on the cooling module, the temperature equalizing plate is mounted on the heat sink base, and parts of the device are mounted on the part mounting seat.