Abstract: An automatic optical inspection (AOI) device and method are disclosed. The device is adapted to inspect an object under inspection (OUI) (102) carried on a workpiece stage (101) and includes: a plurality of detectors (111, 112) for capturing images of the OUI (102); a plurality of light sources (121, 122) for illuminating the OUI (102) in different illumination modes; and a synchronization controller (140) signal-coupled to both the plurality of detectors (111, 112) and the plurality of light sources (121, 122).

Abstract: An apparatus and method for die defect detection are disclosed. The apparatus includes: a light source unit (10) for emitting light of at least two wavelengths; a beam splitter (40) for receiving the light emitted by the light source unit (10) and splitting it into a first portion and a second portion, the first portion of the light reflected by a die (60) surface under inspection and thereby forming a detection beam; a reference unit (70) for receiving the second portion of the light and processing it into a reference beam; and a detection unit (90) for receiving the detection beam and the reference beam. The reference beam crosses the detection beam at an angle and thus produces interference fringes on a sensing surface of the detection unit (90), based on which a defect parameter of the die (60) surface under inspection is determined. This apparatus is capable of measuring a die with improved accuracy and efficiency and is suitable for the measurement of large dies.

Abstract: An apparatus and method for die defect detection are disclosed. The apparatus includes: a light source unit (10) for emitting light of at least two wavelengths; a beam splitter (40) for receiving the light emitted by the light source unit (10) and splitting it into a first portion and a second portion, the first portion of the light reflected by a die (60) surface under inspection and thereby forming a detection beam; a reference unit (70) for receiving the second portion of the light and processing it into a reference beam; and a detection unit (90) for receiving the detection beam and the reference beam. The reference beam crosses the detection beam at an angle and thus produces interference fringes on a sensing surface of the detection unit (90), based on which a defect parameter of the die (60) surface under inspection is determined. This apparatus is capable of measuring a die with improved accuracy and efficiency and is suitable for the measurement of large dies.

Abstract: An automatic optical inspection (AOI) device and method are disclosed. The device is adapted to inspect an object under inspection (OUI) (102) carried on a workpiece stage (101) and includes: a plurality of detectors (111, 112) for capturing images of the OUI (102); a plurality of light sources (121, 122) for illuminating the OUI (102) in different illumination modes; and a synchronization controller (140) signal-coupled to both the plurality of detectors (111, 112) and the plurality of light sources (121, 122).

Abstract: 3D surface inspection apparatus and method are disclosed. The apparatus includes, disposed sequentially, an illumination unit, a polarization splitting unit, a multi-beam splitter, a plurality of phase-shift plates, a polarization combiner and a detector. A light beam from the illumination unit is split by the polarization splitting unit into an inspection beam and a reference beam that are polarized in directions perpendicular to each other. The inspection beam is superimposed with the reference beam, and the superimposition is divided by the multi-beam splitter into a plurality of sub-beams each of which then passes through a corresponding phase-shift plate for generating an additional phase difference between an inspection sub-beam and a reference sub-beam contained in the corresponding sub-beam, so that a plurality of interference signals are generated at the detector surface. The additional phase differences created by the plurality of phase-shift plates are different from one another.

Abstract: A laser annealing apparatus for annealing a silicon wafer placed on a wafer stage is disclosed which includes: a laser light source for generating a light beam; a first optical unit, configured to convert the light beam generated by the laser light source into a polarized light beam of a first type; and a second optical unit, including a light guiding element and a first reflecting element. The light guiding element is configured to make the polarized light beam of the first type incident on and reflected by a surface of the silicon wafer for a first time along a first optical path, and the light beam reflected from the surface of the silicon wafer is further reflected by the first reflecting element and is thereby incident on the surface of the silicon wafer for a second time along a second optical path symmetrical to the first optical path and reflected by the surface to the light guiding element.

Abstract: An off-axis alignment system includes, sequentially along a transmission path of a light beam, an illumination module (10), an interference module (20) and a detection module (30). The interference module (20) includes: a polarization beam splitter (21) having four side faces, the illumination module (10) and the detection modules (30) both located on a first side of the polarization beam splitter (21); a first quarter-wave plate (22) and a first reflector (23), sequentially disposed on a second side opposite to the first side; and a second quarter-wave plate (24) and a cube-corner prism (25), sequentially disposed on a third side of the polarization beam splitter (21); and a third quarter-wave plate (26), a second reflector (27) and a lens (28), sequentially disposed on a fourth side of the polarization beam splitter (21). The second reflector (27) is located on a rear focal plane of the lens (28). A center of a bottom of the cube-corner prism (25) is situated on an optical axis of the lens (28).

Abstract: An off-axis alignment system includes, sequentially along a transmission path of a light beam, an illumination module (10), an interference module (20) and a detection module (30). The interference module (20) includes: a polarization beam splitter (21) having four side faces, the illumination module (10) and the detection modules (30) both located on a first side of the polarization beam splitter (21); a first quarter-wave plate (22) and a first reflector (23), sequentially disposed on a second side opposite to the first side; and a second quarter-wave plate (24) and a cube-corner prism (25), sequentially disposed on a third side of the polarization beam splitter (21); and a third quarter-wave plate (26), a second reflector (27) and a lens (28), sequentially disposed on a fourth side of the polarization beam splitter (21). The second reflector (27) is located on a rear focal plane of the lens (28). A center of a bottom of the cube-corner prism (25) is situated on an optical axis of the lens (28).