Abstract: A film laminating apparatus and an electrode sheet processing device are disclosed. The film laminating apparatus includes a frame, a conveying mechanism, a mounting plate, and a plurality of film laminating mechanisms, the plurality of film laminating mechanisms being mounted on the mounting plate; the conveying mechanism being mounted on the frame and being capable of conveying an electrode sheet in a first direction into the film laminating apparatus; and the mounting plate being mounted on the frame and forming an included angle with the first direction. The plurality of film laminating mechanisms are tilted or vertically arranged relative to the conveying direction of an electrode sheet. The space occupied by the plurality of film laminating mechanisms, the size of the film laminating apparatus, the volume of the film laminating apparatus, and the space occupied by the film laminating apparatus in the conveying direction of the electrode sheet is reduced.

Abstract: The present invention provides a uniform flow control agitation device for electroplating, which involves the rotation of one or two flow-uniformization plates within an electroplating tank. This design effectively eliminates fluctuations in the electroplating solution during the electroplating process, thereby preventing bubbles from forming on the surface of the wafer. Simultaneously, the rotation of the flow-uniformization plates promotes the movement of ions in the electroplating solution, resulting in greater uniformity in the electrodeposit coating on the wafer's surface.