Abstract: The invention discloses a novel LED support structure, including a metal support terminal; an LED chip fixed on the metal support terminal; a bonding wire for connecting the surface of the metal support terminal with the LED chip; and a packaging adhesive for protecting the LED chip. The invention further includes a plastic material covered on the surface of the metal support terminal; and a plastic material reflector cup for coating the metal support terminal. The metal support terminal includes a metal pin embedded in the plastic material reflector cup and a metal tube pin disposed outside the plastic material reflector cup, wherein the metal pin is provided with a functional zone and a non-functional zone.

Abstract: A field emission flat light source and a manufacturing method thereof are provided. The field emission flat light source includes an anode (110), a cathode (120), a light guide plate (130) and a separation body (140). The anode (110) and the light guide plate (130) are separated by the separation body (140). The cathode (120) is provided in the contained space (150) formed by the anode (110), the light guide plate (130) and the separation body (140). The anode (110) includes an anode substrate (112), a metal reflective layer (114) provided on the anode substrate (112) and a light emitting layer (116) provided on the metal reflective layer (114). The cathode (120) includes a cathode substrate (122) and an electron emitter (124) provided on the surface of the cathode substrate (122). The thermal conductivity of the field emission flat light source is improved. The field emission flat light source is applied to the field of the liquid crystal display or the illumination light.

Abstract: The disclosure provides a preparation method for copper oxide nanowires including following steps: step 01, a conductive layer as an electrode is prepared on a clean substrate, or a clean substrate with a conductive layer is provided directly. Step 02, copper powder is weighed up, and the copper powder is homogeneously mixed with organic carrier. Step 03, mixture prepared in step 02 is printed onto the clean substrate with a conductive layer. Step 04, the substrate after being processed by step 03 is sintered under atmosphere having oxygen, and finally cooled to obtain copper oxide nanowires. Adhesion between the copper oxide nanowires prepared in the present disclosure and the substrate is excellent, the copper oxide nanowires may substantially prepared uniformly in large area and under low temperature, technology flow of coating is decreased, a cost of manufacture is decreased, such that a promising method for bottleneck of commercialization process of the field emission device is provided.

Abstract: A field emission flat light source and a manufacturing method thereof are provided. The field emission flat light source includes an anode (110), a cathode (120), a light guide plate (130) and a separation body (140). The anode (110) and the light guide plate (130) are separated by the separation body (140). The cathode (120) is provided in the contained space (150) formed by the anode (110), the light guide plate (130) and the separation body (140). The anode (110) includes an anode substrate (112), a metal reflective layer (114) provided on the anode substrate (112) and a light emitting layer (116) provided on the metal reflective layer (114). The cathode (120) includes a cathode substrate (122) and an electron emitter (124) provided on the surface of the cathode substrate (122). The thermal conductivity of the field emission flat light source is improved. The field emission flat light source is applied to the field of the liquid crystal display or the illumination light.

Abstract: A conductive adhesive mixture includes a component A which is 0.1% to 28% of the dry weight of the conductive adhesive mixture and a component B which is 72% to 99.9% of the dry weight of the conductive adhesive mixture. The component A is selected from one or more of the group consisting of SnCl4, InCl3 and SbCl3; and the component B is selected from one or more of the group consisting of K2O.nSiO2, Na2O.nSiO2, (SiO2)n and Al2O3. The conductive adhesive mixture, having good electrical conductivity, is used for preparation of the fluorescent screen anode plate, greatly improving the life of the luminous layer, thus improving the life and light efficiency of the field emission device. The present invention further provides a fluorescent screen anode plate manufactured with this conductive adhesive mixture and the manufacturing method thereof.

Abstract: The disclosure provides a preparation method for copper oxide nanowires including following steps: step 01, a conductive layer as an electrode is prepared on a clean substrate, or a clean substrate with a conductive layer is provided directly. Step 02, copper powder is weighed up, and the copper powder is homogeneously mixed with organic carrier. Step 03, mixture prepared in step 02 is printed onto the clean substrate with a conductive layer. Step 04, the substrate after being processed by step 03 is sintered under atmosphere having oxygen, and finally cooled to obtain copper oxide nanowires. Adhesion between the copper oxide nanowires prepared in the present disclosure and the substrate is excellent, the copper oxide nanowires may substantially prepared uniformly in large area and under low temperature, technology flow of coating is decreased, a cost of manufacture is decreased, such that a promising method for bottleneck of commercialization process of the field emission device is provided.