Patents by Inventor Pengwei MA

Pengwei MA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12217886
    Abstract: A data transmission cable (100) includes: a signal bundle (110), where the signal bundle (110) includes at least three signal cables, the at least three signal cables are disposed at intervals, pairwise signal cables form a differential pair signal cable, and the differential pair signal cable is used to transmit a differential data signal; a ground cable (120), where the ground cable (120) encircles and covers the signal bundle (110), and the ground cable (120) is used to transmit a ground signal and isolate the signal bundle (110) from a signal bundle (110) of another data transmission cable (100); and a filling medium (130), where the filling medium (130) is disposed in space on an inner side of the ground cable (120) except the signal cable, so that a problem that a MIPI bus has poor transmission quality and a short transmission distance can be resolved.
    Type: Grant
    Filed: November 11, 2022
    Date of Patent: February 4, 2025
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Shangbin Fan, Pengwei Ma, Chao Chen, Tao Gong, Hongli Wang
  • Patent number: 12212881
    Abstract: A electronic device includes a plurality of first photosensitive chips, one first fusion chip, and one processing chip. Each first photosensitive chip is connected to the first fusion chip by a respective data transmission channel and is configured both to generate a MIPI protocol-based data stream and to transmit said data stream to the first fusion chip by the respective data transmission channel. The first fusion chip is connected to the processing chip by a data transmission channel and is configured to converge data streams received via a plurality of data transmission channels connected to the plurality of first photosensitive chips, to obtain a first high-speed convergent data, and to send the first high-speed convergent data to the processing chip. The processing chip is configured to receive the high-speed convergent data stream and obtain an image by using the received data stream.
    Type: Grant
    Filed: January 27, 2023
    Date of Patent: January 28, 2025
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Dongke Zhu, Tao Gong, Pengwei Ma, Hongli Wang, Xiaowen Cao
  • Publication number: 20230171373
    Abstract: A electronic device includes a plurality of first photosensitive chips, one first fusion chip, and one processing chip. Each first photosensitive chip is connected to the first fusion chip by a respective data transmission channel and is configured both to generate a MIPI protocol-based data stream and to transmit said data stream to the first fusion chip by the respective data transmission channel. The first fusion chip is connected to the processing chip by a data transmission channel and is configured to converge data streams received via a plurality of data transmission channels connected to the plurality of first photosensitive chips, to obtain a first high-speed convergent data, and to send the first high-speed convergent data to the processing chip. The processing chip is configured to receive the high-speed convergent data stream and obtain an image by using the received data stream.
    Type: Application
    Filed: January 27, 2023
    Publication date: June 1, 2023
    Inventors: Dongke Zhu, Tao Gong, Pengwei Ma, Hongli Wang, Xiaowen Cao
  • Publication number: 20230076232
    Abstract: A data transmission cable (100) includes: a signal bundle (110), where the signal bundle (110) includes at least three signal cables, the at least three signal cables are disposed at intervals, pairwise signal cables form a differential pair signal cable, and the differential pair signal cable is used to transmit a differential data signal; a ground cable (120), where the ground cable (120) encircles and covers the signal bundle (110), and the ground cable (120) is used to transmit a ground signal and isolate the signal bundle (110) from a signal bundle (110) of another data transmission cable (100); and a filling medium (130), where the filling medium (130) is disposed in space on an inner side of the ground cable (120) except the signal cable ,so that a problem that a MIPI bus has poor transmission quality and a short transmission distance can be resolved.
    Type: Application
    Filed: November 11, 2022
    Publication date: March 9, 2023
    Inventors: Shangbin FAN, Pengwei MA, Chao CHEN, Tao GONG, Hongli WANG