Abstract: The present disclosure provides an intelligent monitoring system and method for wire net wafering. The system includes a monitoring unit, equipped with a monitor for capturing position data of cutting wires in a wire net; and a control unit, provided with a controller for receiving the data captured by the monitor, processing the data and notifying a wafering machine based on results of the processing to perform optimization and adjustment. This can solve the technical problem of being unable to monitor the status of a wire net in real time during a wafering process in the existing arts, automatically monitor the status of curvature of the wire net, judge whether the status of the wire net is abnormal, and effectively notify the wafering machine in time, if a problem is encountered, to perform parameter adjustment or transfer to manual intervention.

Abstract: A wire net monitoring device includes at least one monitor configured to monitor at least one wire net. A signal route of the at least one monitor is configured to monitor the at least one wire net near a side of a workpiece along a rotation direction of the at least one wire net, and the signal route of the at least one monitor crosses a contact surface between the at least one wire net and the workpiece.

Abstract: A monitoring mechanism at least includes a monitoring unit, the monitoring unit is disposed in a slicing chamber and is configured to continuously monitor a state of a wire mesh and have no contact with the wire mesh. The monitoring mechanism of the present disclosure can continuously monitor the state of the wire mesh in the slicing chamber, especially accurately and timely track and monitor in a location of wire mesh nonstop in a non-contact way in a darkroom with serious vapor and a lot of silicon mud during slicing, which provides a solid foundation for precise determination of an abnormal wire mesh. The entire structure occupies a small space in the limited slicing chamber, and the structure is simple and safe such that data of the state of the wire mesh can be obtained timely accurately to prevent a risk of missing or wrong determination.

Abstract: A processing method for a wire mesh abnormality includes the steps of: obtaining position heights of cutting wires in a wire mesh; obtaining a jumping value of each of the cutting wires based on a vertical difference between each of the position heights of the cutting wires and a position height of a contact surface of the wire mesh and a workpiece; obtaining a jumping curve of the wire mesh based on the obtained jumping values of the cutting wires; and determining whether the wire mesh is abnormal based on the jumping curve of the wire mesh. The states of the wire mesh can be monitored in real time, the occurrence of the abnormality problem of the wire mesh can be predicted in advance, and corresponding processes can be performed in time. A processing system for a wire mesh abnormality and an electronic device are also provided.

Abstract: A processing method of cutting through a workpiece includes following steps: obtaining measured bow values of all areas in a wire net when a feed rate of a workpiece cutting reaches a preset threshold, comparing the measured bow values of all areas in an obtained wire net with a standard bow value when the workpiece is cut through, determining that the workpiece has been cut through when the measured bow values of all areas in the wire net are less than or equal to the standard bow value, and determining that the workpiece is not cut through when any area of the wire net has a measured bow value greater than the standard bow value.

Abstract: Embodiments of the present disclosure are directed to a cleaning device for a net monitor and a slicer equipped with the cleaning device. The cleaning device includes a cleaning member. The cleaning member is constructed with a cavity and a plurality of the tunnels provided at one end of the cavity. The tunnels diverge from one end of the cavity to one side of the outer end face of the cleaning member. Angles between axes of the tunnels and an axis of the cavity are different from each other.