Patents by Inventor Per Arne Wang

Per Arne Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAFER STACK CLEANING
    Publication number: 20110168212
    Abstract: The invention comprises a device and method for surface cleaning of individual wafers or substrates arranged in a stack along a stacking direction, where a jet of fluid is sent towards the stack in a direction perpendicular to the stacking direction and it is provided a relative movement between the wafer stack and the nozzle in the stacking direction.
    Type: Application
    Filed: January 15, 2009
    Publication date: July 14, 2011
    Applicant: REC ScanWafer AS
    Inventors: Per Arne Wang, Arne Ramsland, Ole Christian Tronrud, Erik Hjertaas, Bent Hammel, André Skeie, Ola Tronrud
  • Reduction of attraction forces between silicon wafers
    Patent number: 7967915
    Abstract: A method for reducing attraction forces between wafers (4) is provided. This method includes the step of, after sawing and before dissolution of the adhesive (5), introducing spacers (6) between wafers (4). A wafer singulation method and an agent for use in the method are also provided.
    Type: Grant
    Filed: June 26, 2006
    Date of Patent: June 28, 2011
    Assignee: REC Scanwafer AS
    Inventors: Erik Sauar, Per Arne Wang
  • Method For Separating Wafers From A Stack Of Wafers
    Publication number: 20090226283
    Abstract: The invention concerns a method for individually separating wafers from a stack of wafers by placing the stack of wafers in a microwave chamber, and exposing the wafers for microwaves causing the water between the wafers to evaporate.
    Type: Application
    Filed: March 13, 2007
    Publication date: September 10, 2009
    Applicant: REC SCANWAFER AS
    Inventors: Eivind Johannes Ovrelid, Zuhair Kamil Sallom, Thor Christian Tuv, Per Arne Wang
  • Reduction of Attraction Forces Between Silicon Wafers
    Publication number: 20090117713
    Abstract: The present invention is related to a method for reducing attraction forces between wafers (4). This method is characterized in that it comprises the step of, after sawing and before dissolution of the adhesive (5), introducing spacers (6) between wafers (4). The invention comprises also a wafer singulation method and an agent for use in said methods.
    Type: Application
    Filed: June 26, 2006
    Publication date: May 7, 2009
    Applicant: REC SCANWAFER AS
    Inventors: Erik Sauar, Per Arne Wang
  • Method and device for separating silicon wafers
    Publication number: 20080146003
    Abstract: The invention relates to a method for separation of a silicon wafer (12a) from a vertical stack (10) of silicon wafers (12). The method is characterised in that it comprises attaching a movable transport device (2) to a surface of the silicon wafer (12a) in the stack (10), and horizontal movement of the silicon wafer (12a) parallel (A) to the surface of the silicon wafer (12a) until the silicon wafer (12a) is separated from the stack (10). The invention also comprises a device for implementing the method.
    Type: Application
    Filed: December 19, 2007
    Publication date: June 19, 2008
    Applicant: REC ScanWafer AS
    Inventors: Per Arne Wang, Arne Ramsland, Ole Christian Tronrud, Erik Hjertaas, Bent Hammel, Andre Skeie, Ola Tronrud