Patents by Inventor Per-Erik Gustafsson

Per-Erik Gustafsson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230189446
    Abstract: A method for mounting a component (100) on a workpiece (106), the method comprising obtaining information regarding a surface topography of at least one of a mounting surface (102) of the component and a local surface (108) of the workpiece onto which the component is to be mounted. The method further comprises forming a plurality of deposits (110) of a viscous medium on at least one of the mounting and local surfaces, wherein each of the plurality of deposits has a height (/½, /½, h3) based on the obtained information, and is formed by individually applying at least one droplet (234) of the viscous medium (232) using non-contact dispensing. The method further comprises placing the component on the substrate, such that the plurality of deposits of viscous medium forms a connection between the component and the workpiece.
    Type: Application
    Filed: May 26, 2021
    Publication date: June 15, 2023
    Applicant: Mycronic AB
    Inventors: Gustaf MARTENSSON, Per-Erik GUSTAFSSON
  • Patent number: 9648795
    Abstract: A pick-and-place tool configured to pick and place at least one die on a workpiece includes a mounting head. The mounting head includes a die position determining unit configured to one of measure and detect an actual position of at least one die during a time between the placement of the at least one die on the workpiece and the picking up of a subsequent die for placement on the workpiece.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: May 9, 2017
    Assignee: MYCRONIC AB
    Inventors: Per-Erik Gustafsson, Mikael Wahlsten
  • Patent number: 9341962
    Abstract: In a method for patterning a workpiece provided with dies in a direct write machine, pattern data associated with a selected die, or group of dies, is transformed into adjusted circuit pattern data dependent both on the original pattern data and the transformed positions, wherein the adjusted circuit pattern data represents the circuit pattern of the plurality of dies, or group of dies, such that the adjusted circuit pattern is fitted to a plurality of sub-areas of the workpiece area, and wherein each sub-area is associated with a die, or group of dies, among the plurality of dies distributed on the workpiece. A pattern is then written on the workpiece according to the adjusted circuit pattern data.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: May 17, 2016
    Assignee: MYCRONIC AB
    Inventors: Mikael Wahlsten, Per-Erik Gustafsson
  • Patent number: 9032611
    Abstract: A pick-and-place tool configured to pick and place at least one die on a workpiece includes a mounting head. The mounting head includes a die position determining unit configured to one of measure and detect an actual position of at least one die during a time between the placement of the at least one die on the workpiece and the picking up of a subsequent die for placement on the workpiece.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: May 19, 2015
    Assignee: Mycronic AB
    Inventors: Per-Erik Gustafsson, Mikael Wahlsten
  • Patent number: 9032342
    Abstract: A method of patterning a plurality of layers of a work piece in a series of writing cycles in one or a plurality of write machines, the workpiece being deviced to have a number of N layers and layers of the workpiece having one or a plurality of boundary condition(s) for pattern position, the method comprising the steps of: determining the boundary conditions of layers 1 to N, calculating deviations due to the boundary conditions and calculating a compensation for the deviation of the first transformation added with the assigned part of the deviation due to the boundary conditions.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: May 12, 2015
    Assignee: Mycronic AB
    Inventors: Mikael Wahlsten, Per-Erik Gustafsson
  • Publication number: 20150082620
    Abstract: A pick-and-place tool configured to pick and place at least one die on a workpiece includes a mounting head. The mounting head includes a die position determining unit configured to one of measure and detect an actual position of at least one die during a time between the placement of the at least one die on the workpiece and the picking up of a subsequent die for placement on the workpiece.
    Type: Application
    Filed: December 2, 2014
    Publication date: March 26, 2015
    Inventors: Per-Erik GUSTAFSSON, Mikael WAHLSTEN
  • Patent number: 8594824
    Abstract: A method for patterning a workpiece in a direct write machine in the manufacturing of a multilayer stack, wherein a first circuit pattern comprising patterns for connection points is transformed according to determined fitting tolerances to fit to connection points of a second circuit pattern and to circuit pattern(s) of specific features such as random placed dies, or group of dies, on or in the workpiece. The second layer may be a previously formed layer or a layer to be formed on the same workpiece or on a different workpiece for the stack. Pattern data associated with selected die is transformed into adjusted circuit pattern data using the transformation defined by the transformed positions such that the circuit pattern is fitted to the selected die(s).
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: November 26, 2013
    Assignee: Micronic Mydata AB
    Inventors: Mikael Wahlsten, Per-Erik Gustafsson
  • Patent number: 8594825
    Abstract: A method of patterning a plurality of layers of a work piece in a series of write machines, wherein errors due to different transformation capabilities of different machines are compensated by distributing the errors over the plurality of layers.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: November 26, 2013
    Assignee: Micronic Mydata AB
    Inventors: Mikael Wahlsten, Per-Erik Gustafsson, Thomas Öström
  • Patent number: 8530120
    Abstract: A method for patterning a second layer of a work piece in a direct write machine in the manufacturing of a multilayer system-in-package stack. The work piece having a first layer with a plurality of electrical components in the form of dies arbitrarily placed. Each component having connection points where some need to be connected between the components. A first pattern wherein different zones comprising connection points of dies distributed in the first layer are associated with different requirements on alignment. The method comprising the steps of: a. Detecting sacred zones in first pattern that have a high requirement on alignment to selected features of the system-in-package stack or to the placed components; b. Detecting stretch zones of the first pattern that are allowed to have a lower requirement on alignment to other features of the system-in-package stack; c.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: September 10, 2013
    Assignee: Micronic Mydata AB
    Inventors: Mikael Wahlsten, Per-Erik Gustafsson
  • Publication number: 20120066898
    Abstract: A pick-and-place tool configured to pick and place at least one die on a workpiece includes a mounting head. The mounting head includes a die position determining unit configured to one of measure and detect an actual position of at least one die during a time between the placement of the at least one die on the workpiece and the picking up of a subsequent die for placement on the workpiece.
    Type: Application
    Filed: September 15, 2011
    Publication date: March 22, 2012
    Applicant: MICRONIC MYDATA AB
    Inventors: Per-Erik Gustafsson, Mikael Wahlsten
  • Publication number: 20110257777
    Abstract: A method for patterning a second layer of a work piece in a direct write machine in the manufacturing of a multilayer system-in-package stack. The work piece having a first layer with a plurality of electrical components in the form of dies arbitrarily placed. Each component having connection points where some need to be connected between the components. A first pattern wherein different zones comprising connection points of dies distributed in the first layer are associated with different requirements on alignment. The method comprising the steps of: a. Detecting sacred zones in first pattern that have a high requirement on alignment to selected features of the system-in-package stack or to the placed components; b. Detecting stretch zones of the first pattern that are allowed to have a lower requirement on alignment to other features of the system-in-package stack; c.
    Type: Application
    Filed: February 28, 2011
    Publication date: October 20, 2011
    Applicant: Micronic Mydata AB
    Inventors: Mikael Wahlsten, Per-Erik Gustafsson
  • Publication number: 20110213479
    Abstract: In a method for patterning a workpiece provided with dies in a direct write machine, pattern data associated with a selected die, or group of dies, is transformed into adjusted circuit pattern data dependent both on the original pattern data and the transformed positions, wherein the adjusted circuit pattern data represents the circuit pattern of the plurality of dies, or group of dies, such that the adjusted circuit pattern is fitted to a plurality of sub-areas of the workpiece area, and wherein each sub-area is associated with a die, or group of dies, among the plurality of dies distributed on the workpiece. A pattern is then written on the workpiece according to the adjusted circuit pattern data.
    Type: Application
    Filed: February 28, 2011
    Publication date: September 1, 2011
    Applicant: Micronic Mydata AB
    Inventors: Mikael Wahlsten, Per-Erik Gustafsson
  • Publication number: 20110210104
    Abstract: A method of patterning a plurality of layers of a work piece in a series of writing cycles in one or a plurality of write machines, the workpiece being deviced to have a number of N layers and layers of the workpiece having one or a plurality of boundary condition(s) for pattern position, the method comprising the steps of: determining the boundary conditions of layers 1 to N, calculating deviations due to the boundary conditions and calculating a compensation for the deviation of the first transformation added with the assigned part of the deviation due to the boundary conditions.
    Type: Application
    Filed: February 28, 2011
    Publication date: September 1, 2011
    Applicant: Micronic Mydata AB
    Inventors: Mikael Wahlsten, Per-Erik Gustafsson
  • Publication number: 20110213484
    Abstract: A method for patterning a workpiece in a direct write machine in the manufacturing of a multilayer stack, wherein a first circuit pattern comprising patterns for connection points is transformed according to determined fitting tolerances to fit to connection points of a second circuit pattern and to circuit pattern(s) of specific features such as random placed dies, or group of dies, on or in the workpiece. The second layer may be a previously formed layer or a layer to be formed on the same workpiece or on a different workpiece for the stack. Pattern data associated with selected die is transformed into adjusted circuit pattern data using the transformation defined by the transformed positions such that the circuit pattern is fitted to the selected die(s).
    Type: Application
    Filed: February 28, 2011
    Publication date: September 1, 2011
    Applicant: Micronic Mydata AB
    Inventors: Mikael Wahlsten, Per-Erik Gustafsson
  • Publication number: 20110213487
    Abstract: A method of patterning a plurality of layers of a work piece in a series of write machines, wherein errors due to different transformation capabilities of different machines are compensated by distributing the errors over the plurality of layers.
    Type: Application
    Filed: February 28, 2011
    Publication date: September 1, 2011
    Applicant: Micronic Mydata AB
    Inventors: Mikael Wahlsten, Per-Erik Gustafsson
  • Patent number: 7705965
    Abstract: The present disclosure relates to formation of latent images in a radiation sensitive layer applied to a substrate that is transparent to or transmissive of radiation at the exposing wavelength. In particular, it relates to so-called backside lithography, in which the final lens of an exposing system is positioned to project electromagnetic radiation through a first side of the transparent substrate and expose a radiation sensitive layer that overlays a second side of the transparent substrate that is opposite the first side. Five alternative embodiments for further treatment to form a radiation opaque layer corresponding to the latent image (the image or its inverse) are described. These methods and corresponding devices are useful for producing masks (sometimes called reticles), for producing latent images in semiconductor devices and for forming features of semiconductor devices using masks.
    Type: Grant
    Filed: May 15, 2007
    Date of Patent: April 27, 2010
    Assignee: Micronic Laser Systems AB
    Inventors: Per-Erik Gustafsson, Ulric Ljungblad
  • Publication number: 20070263187
    Abstract: The present disclosure relates to formation of latent images in a radiation sensitive layer applied to a substrate that is transparent to or transmissive of radiation at the exposing wavelength. In particular, it relates to so-called backside lithography, in which the final lens of an exposing system is positioned to project electromagnetic radiation through a first side of the transparent substrate and expose a radiation sensitive layer that overlays a second side of the transparent substrate that is opposite the first side. Five alternative embodiments for further treatment to form a radiation opaque layer corresponding to the latent image (the image or its inverse) are described. These methods and corresponding devices are useful for producing masks (sometimes called reticles), for producing latent images in semiconductor devices and for forming features of semiconductor devices using masks.
    Type: Application
    Filed: May 15, 2007
    Publication date: November 15, 2007
    Applicant: Micronic Laser Systems AB
    Inventors: Per-Erik Gustafsson, Ulric Ljungblad
  • Patent number: 5800658
    Abstract: The present invention is for method and means by the manufacture of a product of expanded polymer, by which is obtained a weight per unit volume which is essentially lower than that of homogeneous expanded material. The starting material according to the invention can be either a specifically manufactured starting material or scrap and recovered material. The pieces of expanded polymer are supplied in controlled quantities through a feeder to a space for the application of glue drops which are sprayed into the space from one or more dies. In the space the pieces of polymer are dried by means of micro-wave energy which is obtained from an energy generator and magnetrones. The dried pieces then are discarded from the space together with the air flow through the opening. By the manufacture of a product according to the invention one starts from the pieces with glue applied to them as described above. The pieces are put into a mould wherein they are pressed against each other.
    Type: Grant
    Filed: October 8, 1997
    Date of Patent: September 1, 1998
    Assignee: Cirrus AB
    Inventors: Per Erik Gustafsson, Ulf Haggstam