Abstract: A method for forming grooves in a board element. An exemplary method includes arranging the board element in contact with a support member, and forming at least one groove in a rear side of the board element by removing material, such as chips, from the board element by rotating one or more cutting devices including a plurality of tooth elements configured to rotate around a rotational axis. A method further includes counteracting, such as preventing, a displacement of the board element away from the support member during forming of the at least one groove, wherein the counteracting, such as preventing, includes arranging at least a portion of the board element between an obstruction element and the support member.

Abstract: A method for forming grooves in a board element. An exemplary method includes arranging the board element in contact with a support member, and forming at least one groove in a rear side of the board element by removing material, such as chips, from the board element by rotating one or more cutting devices including a plurality of tooth elements configured to rotate around a rotational axis. A method further includes counteracting, such as preventing, a displacement of the board element away from the support member during forming of the at least one groove, wherein the counteracting, such as preventing, includes arranging at least a portion of the board element between an obstruction element and the support member.

Abstract: The present disclosure relates to a method to produce a coating layer, including applying a coating composition on a surface of a carrier, curing the coating composition to a coating layer, and subsequently applying pressure to the coating layer. The disclosure further relates to a method to produce a building panel, and such a building panel, and to a method to produce a coated foil, and such a coated foil.

Abstract: An underlay element configured to be provided between a floor covering and a subfloor. The underlay element includes a base matrix and a plurality of restriction members at least partly embedded in the base matrix. The base matrix includes a first material which is compressible and, preferably, foamed. The restriction members include a second material, wherein a size of each of the restriction members exceeds 0.25 mm in at least one direction. A compression of the underlay element is configured to be restricted by the restriction members. Also, a corresponding floor assembly including a floor covering and an underlay element.

Abstract: A panel, such as a floor panel, including a core, an optional upper arrangement and an optional lower arrangement. One or more of the core, the upper arrangement (5) and the lower arrangement includes a mineral-based layer, preferably including magnesium oxide. One or more of the mineral-based layers includes reinforcement fibres embedded in a mineral-based matrix, preferably including magnesium oxide. The fibres are configured to increase the tensile strength of the mineral-based layer.

Abstract: A building panel, such as a floor panel, having a core comprising at least one or more of a thermoplastic material, a thermoset material, a mineral based material or a combination thereof. The building panel further including a first arrangement, arranged on said core, having a surface layer and a sublayer, where the sublayer is arranged between the core and the surface layer.

Abstract: A process for manufacturing a board element. The process includes providing a substrate including a polymer-based material and a plurality of cavities in a rear side, arranging a printing pattern on a front side of the substrate, and coordinating a position of the printing pattern with a location of the cavities.

Abstract: An underlay element configured to be provided between a floor covering and a subfloor. The underlay element includes a base matrix and a plurality of restriction members at least partly embedded in the base matrix. The base matrix includes a first material which is compressible and, preferably, foamed. The restriction members include a second material, wherein a size of each of the restriction members exceeds 0.25 mm in at least one direction. A compression of the underlay element is configured to be restricted by the restriction members. Also, a corresponding floor assembly including a floor covering and an underlay element.

Abstract: A mineral-based floor panel including a mineral-based core, wherein the panel includes at least one groove. The at least one groove may be provided in a rear side of the panel. There is also disclosed other such mineral-based panels, such as a building panel, a wall panel, a ceiling panel or a furniture panel. There is also disclosed a method for forming such grooves in a mineral-based panel. Furthermore, there is disclosed a mineral-based panel including a mineral-based core and polymer-based lower layer(s) attached to the core. A locking system of the panel includes a strip extending horizontally beyond an upper portion of the panel, wherein at least a horizontal portion of the strip is entirely formed in the polymer-based lower layer(s).

Abstract: A process for manufacturing a board element including a plurality of cavities in a rear side thereof. The process includes displacing a substrate including a thermoplastic material in a feeding direction towards a pressing area of an impression device including a plurality of protruding impression elements and creating the cavities in a rear side of the substrate by impressing a substrate portion in the pressing area by the impression device, thereby obtaining the board element. An upstream thickness of the substrate upstream of the impression device exceeds a gap height of the pressing area during at least a part of an impression cycle.

Abstract: A panel, such as a floor panel, including a core, an optional upper arrangement and an optional lower arrangement. One or more of the core, the upper arrangement (5) and the lower arrangement includes a mineral-based layer, preferably including magnesium oxide. One or more of the mineral-based layers includes reinforcement fibres embedded in a mineral-based matrix, preferably including magnesium oxide. The fibres are configured to increase the tensile strength of the mineral-based layer.

Abstract: A mineral-based floor panel including a mineral-based core, wherein the panel includes at least one groove. The at least one groove may be provided in a rear side of the panel. There is also disclosed other such mineral-based panels, such as a building panel, a wall panel, a ceiling panel or a furniture panel. There is also disclosed a method for forming such grooves in a mineral-based panel. Furthermore, there is disclosed a mineral-based panel including a mineral-based core and polymer-based lower layer(s) attached to the core. A locking system of the panel includes a strip extending horizontally beyond an upper portion of the panel, wherein at least a horizontal portion of the strip is entirely formed in the polymer-based lower layer(s).

Abstract: A process for manufacturing a board element including a thermoplastic material, wherein a rear side of the board element includes a cavity region. The process includes shaping a first material in shaping units of a shaping member, wherein the first material includes a thermoplastic material, heating the first material, and hardening the shaped first material for forming protrusions in a rear side of a substrate, wherein the substrate includes a second material including a thermoplastic material. Thereby a board element including the cavity region created between the protrusions is obtained.

Abstract: A panel, such as a floor panel, including a core, an optional upper arrangement, and an optional lower arrangement. One or more of the core, the upper arrangement and the lower arrangement includes a mineral-based layer, preferably including magnesium oxide. One or more of the mineral-based layers includes reinforcement fibres embedded in a mineral-based matrix, preferably including magnesium oxide. The fibres are configured to increase the tensile strength of the mineral-based layer.

Abstract: A method to manufacture a bevel at least partly along at least one edge of a building panel, such as a floor panel or wall panel, where the building panel includes a polymer-based material. The method includes creating an indentation in an edge portion of the at least one edge of the building panel, where the indentation is located at a distance from a surface of the building panel, in a direction substantially perpendicular to the surface of the building panel. The method further including heating at least an area between the indentation and the surface of the building panel in which the bevel is to be formed and applying pressure to the surface for forming a bevel of the building panel.

Abstract: A building panel and a method for manufacturing such a building panel where the building panel may be e.g. a floor panel or wall panel. The method including joining a substrate material and a sublayer material to form a substrate and a sublayer of the building panel. The method further includes applying a surface layer on the sublayer, applying pressure to form the building panel, and forming a bevel along at least one edge of the building panel by means of a pressing device. The sublayer is configured to be at least partly plastically deformable when pressure is applied in order to at least form the bevel of the building panel.

Abstract: A method to manufacture a bevel at least partly along at least one edge of a building panel, such as a floor panel or wall panel, where the building panel includes a substrate having an inorganic filler of an amount of 50-85 wt % and a polymer-based material. The method including heating at least an edge portion of an edge of the building panel, along which edge the bevel is to be formed, and forming the bevel in the edge portion by applying pressure to the portion, where the bevel is at least partly formed in the substrate.

Abstract: A process for manufacturing a board element including at least one cavity in a rear side thereof. The process includes providing a substrate including a thermoplastic material, wherein the substrate includes a substrate portion, and creating the at least one cavity in a rear side of the substrate by impressing the substrate portion by an impression device including at least one protruding impression element, thereby obtaining the board element. The substrate portion is disposed at an elevated temperature (TS) of 40-295° C. when creating the at least one cavity. The process includes creating at least one tapering cavity by means of at least one tapering impression element.

Abstract: A method to produce a laminated substrate with an embossed structure, including: providing a polymer based film printed by at least a first gravure cylinder forming a first pattern and a second gravure cylinder forming a second pattern, wherein a circumference of the second gravure cylinder exceeds a circumference of the first gravure cylinder, applying the polymer based film on a substrate including a polymer based material, pressing said polymer based film to the substrate, thereby forming a laminated substrate, and embossing the laminated substrate by an embossing device such that the laminated substrate obtains an embossed structure, wherein a perimeter of the embossing device corresponds to the circumference of the first gravure cylinder or to the circumference of the second gravure cylinder.

Abstract: A method to produce a panel with an embossed structure, including forming a substrate by a continuous process, wherein the substrate includes a polymer based material, providing a printed polymer based film, applying the printed polymer based film on the substrate, the printed polymer based film being continuously applied on the substrate, pressing the printed polymer based film to the substrate, thereby forming a laminated substrate, and embossing the laminated substrate by an embossing device having a perimeter, such that the laminated substrate obtains an embossed structure, dividing the laminated substrate into panels, each panel having a length and a width, and wherein the perimeter of the embossing device divided by the length of said panel is a non-integer.