Abstract: A process for manufacturing a board element including a thermoplastic material, wherein a rear side of the board element includes a cavity region. The process includes shaping a first material in shaping units of a shaping member, wherein the first material includes a thermoplastic material, heating the first material, and hardening the shaped first material for forming protrusions in a rear side of a substrate, wherein the substrate includes a second material including a thermoplastic material. Thereby a board element including the cavity region created between the protrusions is obtained.

Abstract: A panel, such as a floor panel, including a core, an optional upper arrangement, and an optional lower arrangement. One or more of the core, the upper arrangement and the lower arrangement includes a mineral-based layer, preferably including magnesium oxide. One or more of the mineral-based layers includes reinforcement fibres embedded in a mineral-based matrix, preferably including magnesium oxide. The fibres are configured to increase the tensile strength of the mineral-based layer.

Abstract: A method to manufacture a bevel at least partly along at least one edge of a building panel, such as a floor panel or wall panel, where the building panel includes a polymer-based material. The method includes creating an indentation in an edge portion of the at least one edge of the building panel, where the indentation is located at a distance from a surface of the building panel, in a direction substantially perpendicular to the surface of the building panel. The method further including heating at least an area between the indentation and the surface of the building panel in which the bevel is to be formed and applying pressure to the surface for forming a bevel of the building panel.

Abstract: A method to manufacture a bevel at least partly along at least one edge of a building panel, such as a floor panel or wall panel, where the building panel includes a substrate having an inorganic filler of an amount of 50-85 wt % and a polymer-based material. The method including heating at least an edge portion of an edge of the building panel, along which edge the bevel is to be formed, and forming the bevel in the edge portion by applying pressure to the portion, where the bevel is at least partly formed in the substrate.

Abstract: A building panel and a method for manufacturing such a building panel where the building panel may be e.g. a floor panel or wall panel. The method including joining a substrate material and a sublayer material to form a substrate and a sublayer of the building panel. The method further includes applying a surface layer on the sublayer, applying pressure to form the building panel, and forming a bevel along at least one edge of the building panel by means of a pressing device. The sublayer is configured to be at least partly plastically deformable when pressure is applied in order to at least form the bevel of the building panel.

Abstract: A process for manufacturing a board element including at least one cavity in a rear side thereof. The process includes providing a substrate including a thermoplastic material, wherein the substrate includes a substrate portion, and creating the at least one cavity in a rear side of the substrate by impressing the substrate portion by an impression device including at least one protruding impression element, thereby obtaining the board element. The substrate portion is disposed at an elevated temperature (TS) of 40-295° C. when creating the at least one cavity. The process includes creating at least one tapering cavity by means of at least one tapering impression element.

Abstract: A method to produce a laminated substrate with an embossed structure, including: providing a polymer based film printed by at least a first gravure cylinder forming a first pattern and a second gravure cylinder forming a second pattern, wherein a circumference of the second gravure cylinder exceeds a circumference of the first gravure cylinder, applying the polymer based film on a substrate including a polymer based material, pressing said polymer based film to the substrate, thereby forming a laminated substrate, and embossing the laminated substrate by an embossing device such that the laminated substrate obtains an embossed structure, wherein a perimeter of the embossing device corresponds to the circumference of the first gravure cylinder or to the circumference of the second gravure cylinder.

Abstract: A method to produce a panel with an embossed structure, including forming a substrate by a continuous process, wherein the substrate includes a polymer based material, providing a printed polymer based film, applying the printed polymer based film on the substrate, the printed polymer based film being continuously applied on the substrate, pressing the printed polymer based film to the substrate, thereby forming a laminated substrate, and embossing the laminated substrate by an embossing device having a perimeter, such that the laminated substrate obtains an embossed structure, dividing the laminated substrate into panels, each panel having a length and a width, and wherein the perimeter of the embossing device divided by the length of said panel is a non-integer.

Abstract: The present disclosure relates to a method to produce a coating layer, including applying a coating composition on a surface of a carrier, curing the coating composition to a coating layer, and subsequently applying pressure to the coating layer. The disclosure further relates to a method to produce a building panel, and such a building panel, and to a method to produce a coated foil, and such a coated foil.

Abstract: A panel, such as a floor panel, including a core, an optional upper arrangement and an optional lower arrangement. One or more of the core, the upper arrangement and the lower arrangement includes a mineral-based layer, preferably including magnesium oxide. One or more of the mineral-based layers includes reinforcement fibres embedded in a mineral-based matrix, preferably including magnesium oxide. The fibres are configured to increase the tensile strength of the mineral-based layer.

Abstract: A thermoplastic-based building panel, such as a floor panel. The building panel includes an upper layer arrangement, a lower layer arrangement, and a balancing layer provided between the lower and the upper layer arrangement. The building panel further includes a groove arrangement including grooves. A thermoplastic-based building panel including an upper layer arrangement and a balancing layer which is a bottom layer of the building panel. The building panel includes a groove arrangement, wherein a major portion of the grooves therein is provided in the balancing layer only. A thermoplastic-based building panel including a mechanical locking system for horizontally and/or vertically locking the building panel to an adjacent building panel. The mechanical locking system includes a cooperating surface which is situated in a balancing layer and is configured to cooperate with a cooperating surface of an adjacent building panel.

Abstract: A method for forming grooves in a board element. An exemplary method includes arranging the board element in contact with a support member, and forming at least one groove in a rear side of the board element by removing material, such as chips, from the board element by rotating one or more cutting devices including a plurality of tooth elements configured to rotate around a rotational axis. A method further includes counteracting, such as preventing, a displacement of the board element away from the support member during forming of the at least one groove, wherein the counteracting, such as preventing, includes arranging at least a portion of the board element between an obstruction element and the support member.

Abstract: A method to produce a laminated substrate with an embossed structure, including: providing a polymer based film printed by at least one gravure cylinder, applying the polymer based film on a substrate including a polymer based material, pressing said polymer based film to the substrate, thereby forming a laminated substrate, and embossing the laminated substrate by an embossing device such that the laminated substrate obtains an embossed structure, wherein a circumference of said at least one gravure cylinder exceeds a perimeter of the embossing device, and wherein the circumference of said at least one gravure cylinder divided by the perimeter of the embossing device substantially corresponds to an integer.

Abstract: A thermoplastic-based building panel, such as a floor panel. The building panel includes an upper layer arrangement, a lower layer arrangement, and a balancing layer provided between the lower and the upper layer arrangement. The building panel further includes a groove arrangement including grooves. A thermoplastic-based building panel including an upper layer arrangement and a balancing layer which is a bottom layer of the building panel. The building panel includes a groove arrangement, wherein a major portion of the grooves therein is provided in the balancing layer only. A thermoplastic-based building panel including a mechanical locking system for horizontally and/or vertically locking the building panel to an adjacent building panel. The mechanical locking system includes a cooperating surface which is situated in a balancing layer and is configured to cooperate with a cooperating surface of an adjacent building panel.

Abstract: A method for forming grooves in a board element. An exemplary method includes arranging the board element in contact with a support member, and forming at least one groove in a rear side of the board element by removing material, such as chips, from the board element by rotating one or more cutting devices including a plurality of tooth elements configured to rotate around a rotational axis. A method further includes counteracting, such as preventing, a displacement of the board element away from the support member during forming of the at least one groove, wherein the counteracting, such as preventing, includes arranging at least a portion of the board element between an obstruction element and the support member.

Abstract: The disclosure relates to a process for manufacturing a building panel, such as a floor panel, including a core. The process includes providing a core material including a thermoplastic material, a filler and hollow microparticles, and applying heat and pressure to the core material to form the core. The disclosure also relates to a corresponding building panel.

Abstract: A method to produce a panel. The method includes providing a core having a first surface, providing a surface layer including a substantially uncured amino resin, applying an hydrolysable adhesive on the first surface of the core and/or on a surface of the surface layer adapted to face the core, arranging the surface layer on the first surface of the core, pressing the surface layer to the core to form a panel by applying heat and pressure in a press, thereby adhering the surface layer to the core by the hydrolysable adhesive and curing the amino resin of the surface layer. Also such a panel.

Abstract: A building panel having a substrate and a layer arrangement, arranged on one side of the substrate. The layer arrangement having a surface layer and where the surface layer includes carpet fibres. At least the substrate at least partly includes a mechanical locking device for connecting at least two building panels. Where the substrate and the layer arrangement each includes a polymer of the same type of polymer.

Abstract: The present disclosure relates to a method to produce a coating layer, including applying a coating composition on a surface of a carrier, curing the coating composition to a coating layer, and subsequently applying pressure to the coating layer. The disclosure further relates to a method to produce a building panel, and such a building panel, and to a method to produce a coated foil, and such a coated foil.

Abstract: An arrangement for forming grooves in a board element. The arrangement includes a support member for supporting the board element during the forming and cutting elements arranged on a spindle member configured to rotate around a rotational axis. The cutting elements are configured to form the grooves by removing material from the board element. The spindle member is arranged in a pivot body configured to be pivoted with respect to the support member. The arrangement includes a driving device configured to drive the pivot body, wherein the driving device is configured to rotate in a single direction during a groove forming cycle.