Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed including at least one memory; machine-readable instructions; and processor circuitry to at least one of execute or instantiate the machine-readable instructions to: obtain a register-transfer level design defining operations of electrical circuits in first and second dice of a multi-die semiconductor package, the second die to be stacked on the first die in the multi-die semiconductor package; and select placement of a cell for a physical layout for the multi-die semiconductor package based on the register-transfer level design, the cell including a via to electrically interconnect the first die to the second die.