Patents by Inventor Percy Yen

Percy Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compact, low profile electronically scanned antenna
    Patent number: 7417598
    Abstract: A compact, low profile electronically scanned antenna module is provided. The antenna module includes a multi-layer antenna integrated printed wiring board (AiPWB) that includes a radiator layer on a front surface. The radiator layer includes a plurality of RF radiating elements. The antenna module additionally includes a plurality of radiator electronics modules orthogonally connected to a back surface of the AiPWB. The electronics modules are interconnected with radiating elements through the AiPWB and include a plurality of beam steering electronic elements mounted to a multi layer conformable substrate. The orthogonal connections allow the antenna module to have outer dimensions that are substantially equal to the dimensions of a perimeter of the AiPWB.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: August 26, 2008
    Assignee: The Boeing Company
    Inventors: Julio A. Navarro, Devin W. Hersey, Michael H. Florian, Gordon D Osterhues, Percy Yen
  • Compact, low profile electronically scanned antenna
    Publication number: 20080106467
    Abstract: A compact, low profile electronically scanned antenna module is provided. The antenna module includes a multi-layer antenna integrated printed wiring board (AiPWB) that includes a radiator layer on a front surface. The radiator layer includes a plurality of RF radiating elements. The antenna module additionally includes a plurality of radiator electronics modules orthogonally connected to a back surface of the AiPWB. The electronics modules are interconnected with radiating elements through the AiPWB and include a plurality of beam steering electronic elements mounted to a multi layer conformable substrate. The orthogonal connections allow the antenna module to have outer dimensions that are substantially equal to the dimensions of a perimeter of the AiPWB.
    Type: Application
    Filed: November 8, 2006
    Publication date: May 8, 2008
    Inventors: Julio A. Navarro, Devin W. Hersey, Michael H. Florian, Gordon D. Osterhues, Percy Yen