Patents by Inventor Perez ANGELITO BARROZO

Perez ANGELITO BARROZO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dual-sided molding for encapsulating electronic devices
    Patent number: 11621181
    Abstract: A molding system for molding electronic components mounted on first and second sides of a substrate has a molding cavity onto which the substrate is locatable for molding. The molding cavity has a first section covering a molding portion of the first side of the substrate, and a second section covering a molding portion of the second side of the substrate. First and second pots have plungers for compressing molding compound placed therein. First and second runners connect the first and second pots to the first and second sections of the molding cavity for introducing the molding compound onto both sides of the substrate. In particular, the runners extend at least from an edge of the substrate along both sides of the substrate to the molding cavity.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: April 4, 2023
    Assignee: ASMPT SINGAPORE PTE. LTD.
    Inventors: Teng Hock Kuah, Yi Lin, Kar Weng Yan, Perez Angelito Barrozo
  • DUAL-SIDED MOLDING FOR ENCAPSULATING ELECTRONIC DEVICES
    Publication number: 20210351049
    Abstract: A molding system for molding electronic components mounted on first and second sides of a substrate has a molding cavity onto which the substrate is locatable for molding. The molding cavity has a first section covering a molding portion of the first side of the substrate, and a second section covering a molding portion of the second side of the substrate. First and second pots have plungers for compressing molding compound placed therein. First and second runners connect the first and second pots to the first and second sections of the molding cavity for introducing the molding compound onto both sides of the substrate. In particular, the runners extend at least from an edge of the substrate along both sides of the substrate to the molding cavity.
    Type: Application
    Filed: May 5, 2020
    Publication date: November 11, 2021
    Inventors: Teng Hock KUAH, Yi LIN, Kar Weng YAN, Perez ANGELITO BARROZO