Abstract: The disclosure provides a method for forming an integrated component, which includes the following steps: bonding a transparent member and a substrate member together through an adhesive; placing the transparent member and the substrate member which are bonded together in a mould; and forming a housing member at a periphery of the transparent member and the substrate member which are bonded together, through an insert moulding technology, so that the housing member and the transparent member are jointed together tightly to form the integrated component. The disclosure also provides an integrated component formed by the above method. The integrated component formed by the method of the disclosure can better achieve a tight and stable connection between the transparent member and the housing member, achieve an interlocking and seamless connection between the transparent member and the housing member, and guarantee that the quality of the transparent member is not affected.