Patents by Inventor Perng-Kae Wang

Perng-Kae Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device and heat dissipating module thereof
    Patent number: 8018721
    Abstract: An electronic device including a circuit board and a heat dissipating module is provided. The circuit board has a thermal source. The heat dissipating module is disposed on the thermal source and has a heat conducting unit, a first heat dissipating unit and a second heat dissipating unit. The heat conducting unit has a heat conducting plate and a heat pipe. A first surface of the heat conducting plate contacts the thermal source. A first end of the heat pipe is connected to the heat conducting plate. The first heat dissipating unit is connected to a second end of the heat pipe. The second heat dissipating unit is movably disposed on a second surface of the heat conducting plate. The heat dissipating module in the invention can achieve the dual thermal dissipation efficiency via the different cooling modes so as to satisfy the heat dissipating requirement of high speed processors.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: September 13, 2011
    Assignee: Asustek Computer Inc.
    Inventors: Chin-Lien Chang, Ya-Chyi Chou, Ea-Si Lee, Perng-Kae Wang
  • Electronic Device and Heat Dissipating Module Thereof
    Publication number: 20100142147
    Abstract: An electronic device including a circuit board and a heat dissipating module is provided. The circuit board has a thermal source. The heat dissipating module is disposed on the thermal source and has a heat conducting unit, a first heat dissipating unit and a second heat dissipating unit. The heat conducting unit has a heat conducting plate and a heat pipe. A first surface of the heat conducting plate contacts the thermal source. A first end of the heat pipe is connected to the heat conducting plate. The first heat dissipating unit is connected to a second end of the heat pipe. The second heat dissipating unit is movably disposed on a second surface of the heat conducting plate. The heat dissipating module in the invention can achieve the dual thermal dissipation efficiency via the different cooling modes so as to satisfy the heat dissipating requirement of high speed processors.
    Type: Application
    Filed: November 24, 2009
    Publication date: June 10, 2010
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Chin-Lien Chang, Ya-Chyi Chou, Ea-Si Lee, Perng-Kae Wang