Patents by Inventor Perry Kent

Perry Kent has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9779901
    Abstract: The present disclosure provides a high-temperature thermal pellet composition that maintains structural rigidity up to a transition temperature of about 240° C. The composition comprises at least one organic compound (e.g., triptycene or 1-aminoanthroquinone). The pellet can be disposed in a housing of a thermally-actuated, current cutoff device, such as a high-temperature thermal cutoff device (HTTCO). Also provided are material systems, which include the pellet composition and a high-temperature seal that provides substantial sealing up to at least the transition temperature. Methods of making such high-temperature pellet compositions and incorporating them into a thermally-actuated, current cutoff device are also provided.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: October 3, 2017
    Assignee: Therm-O-Disc, Incorporated
    Inventors: Perry Kent, Truong Nguyen
  • Publication number: 20150162153
    Abstract: The present disclosure provides a high-temperature thermal pellet composition that maintains structural rigidity up to a transition temperature of about 240° C. The composition comprises at least one organic compound (e.g., triptycene or 1-aminoanthroquinone). The pellet can be disposed in a housing of a thermally-actuated, current cutoff device, such as a high-temperature thermal cutoff device (HTTCO). Also provided are material systems, which include the pellet composition and a high-temperature seal that provides substantial sealing up to at least the transition temperature. Methods of making such high-temperature pellet compositions and incorporating them into a thermally-actuated, current cutoff device are also provided.
    Type: Application
    Filed: January 9, 2015
    Publication date: June 11, 2015
    Applicant: THERM-O-DISC, INCORPORATED
    Inventors: Perry Kent, Truong Nguyen
  • Patent number: 8961832
    Abstract: The present disclosure provides a high-temperature thermal pellet composition that maintains structural rigidity up to a transition temperature of about 240° C. The composition comprises at least one organic compound (e.g., triptycene or 1-aminoanthroquinone). The pellet can be disposed in a housing of a thermally-actuated, current cutoff device, such as a high-temperature thermal cutoff device (HTTCO). Also provided are material systems, which include the pellet composition and a high-temperature seal that provides substantial sealing up to at least the transition temperature. Methods of making such high-temperature pellet compositions and incorporating them into a thermally-actuated, current cutoff device are also provided.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: February 24, 2015
    Assignee: Therm-O-Disc, Incorporated
    Inventors: Perry Kent, Truong Nguyen
  • Publication number: 20120121795
    Abstract: The present disclosure provides a high-temperature thermal pellet composition that maintains structural rigidity up to a transition temperature of about 240° C. The composition comprises at least one organic compound (e.g., triptycene or 1-aminoanthroquinone). The pellet can be disposed in a housing of a thermally-actuated, current cutoff device, such as a high-temperature thermal cutoff device (HTTCO). Also provided are material systems, which include the pellet composition and a high-temperature seal that provides substantial sealing up to at least the transition temperature. Methods of making such high-temperature pellet compositions and incorporating them into a thermally-actuated, current cutoff device are also provided.
    Type: Application
    Filed: January 17, 2012
    Publication date: May 17, 2012
    Applicant: THERM-O-DISC, INCORPORATED
    Inventors: Perry Kent, Truong Nguyen
  • Publication number: 20100033295
    Abstract: The present disclosure provides high temperature thermal cutoff devices having a high-temperature thermal pellet with a transition temperature of greater than or equal to about 240° C. and comprising at least one organic compound. The pellet is disposed in a housing, which is sealed with a high-temperature seal that provides substantial sealing up to at least the transition temperature. The high-temperature TCO also has a current interruption assembly, which establishes electrical continuity in a first operating condition corresponding to an operating temperature of less than said transition temperature and discontinues electrical continuity when the operating temperature exceeds the transition temperature. Methods of making such high-temperature thermal cut off devices are also provided.
    Type: Application
    Filed: July 30, 2009
    Publication date: February 11, 2010
    Applicant: Therm-O-Disc, Incorporated
    Inventors: Perry Kent, Truong Nguyen