Patents by Inventor Peruvemba Ranganath SAI ANANTHANARAYANAN

Peruvemba Ranganath SAI ANANTHANARAYANAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11134298
    Abstract: A device includes a substrate and a video processor on the substrate. A first patch antenna is mounted to the substrate and configured to transmit and receive radio frequency signals in a frequency range. The first patch antenna is closer to a first end of the substrate than a second end of the substrate. A second patch antenna is mounted to the substrate and is configured to transmit and receive radio frequency signals in the frequency range. The second patch antenna is closer to the first end of the substrate than the second end of the substrate. The substrate includes a ground isolation region between at least one of the first patch antenna and the second patch antenna and the video processor. A media connector is on the substrate and electrically connected to the video processor.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: September 28, 2021
    Assignee: Amazon Technologies, Inc.
    Inventors: Jagan Vaidyanathan Rajagopalan, Ming-Wei Liu, Peruvemba Ranganath Sai Ananthanarayanan, In Chul Hyun, Mohammed Ziaul Azad, Deepak Pai Hosadurga, Sudheep Thota
  • Publication number: 20190364324
    Abstract: A device includes a substrate and a video processor on the substrate. A first patch antenna is mounted to the substrate and configured to transmit and receive radio frequency signals in a frequency range. The first patch antenna is closer to a first end of the substrate than a second end of the substrate. A second patch antenna is mounted to the substrate and is configured to transmit and receive radio frequency signals in the frequency range. The second patch antenna is closer to the first end of the substrate than the second end of the substrate. The substrate includes a ground isolation region between at least one of the first patch antenna and the second patch antenna and the video processor. A media connector is on the substrate and electrically connected to the video processor.
    Type: Application
    Filed: May 22, 2018
    Publication date: November 28, 2019
    Inventors: Jagan Vaidyanathan RAJAGOPALAN, Ming-Wei LIU, Peruvemba Ranganath SAI ANANTHANARAYANAN, In Chul HYUN, Mohammed Ziaul AZAD, Deepak Pai HOSADURGA, Sudheep THOTA