Patents by Inventor Pete E. Kirkpatrick

Pete E. Kirkpatrick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optoelectronic modules and methods of manufacturing the same
    Patent number: 6896422
    Abstract: Optoelectronic modules and methods of manufacturing the same are disclosed. Some of the disclosed modules employ a tape automated bonding substrate (TAB) which is surface mounted with circuit elements. In some examples, the TAB is mounted to a rigid substrate after a fiber submount is passively positioned on the substrate. This modular manufacturing technique limits the value of yield loss. In some example modules, only one active alignment is employed to manufacture the module. Some of the disclosed modules include an optically pluggable connector.
    Type: Grant
    Filed: February 4, 2003
    Date of Patent: May 24, 2005
    Assignee: Intel Corporation
    Inventors: Jeffrey A. Bennett, Pete E. Kirkpatrick, Sylvain M. Colin, Jean-Marc Verdiell
  • Optoelectronic modules and methods of manufacturing the same
    Publication number: 20040151441
    Abstract: Optoelectronic modules and methods of manufacturing the same are disclosed. Some of the disclosed modules employ a tape automated bonding substrate (TAB) which is surface mounted with circuit elements. In some examples, the TAB is mounted to a rigid substrate after a fiber submount is passively positioned on the substrate. This modular manufacturing technique limits the value of yield loss. In some example modules, only one active alignment is employed to manufacture the module. Some of the disclosed modules include an optically pluggable connector.
    Type: Application
    Filed: February 4, 2003
    Publication date: August 5, 2004
    Inventors: Jeffrey A. Bennett, Pete E. Kirkpatrick, Sylvain M. Colin, Jean-Marc Verdiell