Patents by Inventor Pete Hudson

Pete Hudson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip scale packaging on CTE matched printed wiring boards
    Patent number: 6757968
    Abstract: A circuit assembly has a heat sink assembly and a chip scale package assembly. The chip scale package assembly has an integrated circuit die coupled to a first printed wiring board. The heat sink assembly has an integrated circuit die coupled to a second printed wiring board. Preferably, the heat sink assembly and the chip scale package assembly are assembled separately then assembled together. The circuit pads on the first printed wiring board correspond with circuit pads on the second printed wiring board. The circuit pads may be coupled together by solder or adhesive bonding. The circuit pads on the first printed wiring board may have solder balls formed of high temperature solder that do not melt when the heat sink assembly is assembled with chip scale package assembly. The solder balls allow chip scale package assembly to maintain a predetermined distance from the circuit pads on the second printed wiring board.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: July 6, 2004
    Assignee: The Boeing Company
    Inventors: Ching P. Lo, Daniel A. Huang, Pete Hudson
  • Chip scale packaging on CTE matched printed wiring boards
    Patent number: 6560108
    Abstract: A circuit assembly has a heat sink assembly and a chip scale package assembly. The chip scale package assembly has an integrated circuit die coupled to a first printed wiring board. The heat sink assembly has an integrated circuit die coupled to a second printed wiring board. Preferably, the heat sink assembly and the chip scale package assembly are assembled separately then assembled together. The circuit pads on the first printed wiring board correspond with circuit pads on the second printed wiring board. The circuit pads may be coupled together by solder or adhesive bonding. The circuit pads on the first printed wiring board may have solder balls formed of high temperature solder that do not melt when the heat sink assembly is assembled with chip scale package assembly. The solder balls allow chip scale package assembly to maintain a predetermined distance from the circuit pads on the second printed wiring board.
    Type: Grant
    Filed: February 16, 2000
    Date of Patent: May 6, 2003
    Assignee: Hughes Electronics Corporation
    Inventors: Ching P. Lo, Daniel A. Huang, Pete Hudson
  • Chip scale packaging on CTE matched printed wiring boards
    Publication number: 20030011998
    Abstract: A circuit assembly has a heat sink assembly and a chip scale package assembly. The chip scale package assembly has an integrated circuit die coupled to a first printed wiring board. The heat sink assembly has an integrated circuit die coupled to a second printed wiring board. Preferably, the heat sink assembly and the chip scale package assembly are assembled separately then assembled together. The circuit pads on the first printed wiring board correspond with circuit pads on the second printed wiring board. The circuit pads may be coupled together by solder or adhesive bonding. The circuit pads on the first printed wiring board may have solder balls formed of high temperature solder that do not melt when the heat sink assembly is assembled with chip scale package assembly. The solder balls allow chip scale package assembly to maintain a predetermined distance from the circuit pads on the second printed wiring board.
    Type: Application
    Filed: August 30, 2002
    Publication date: January 16, 2003
    Applicant: Hughes Electronics Corporation
    Inventors: C. P. Lo, Daniel A. Huang, Pete Hudson
  • Chip scale packaging on cte matched printed wiring boards
    Publication number: 20010046120
    Abstract: A circuit assembly has a heat sink assembly and a chip scale package assembly. The chip scale package assembly has an integrated circuit die coupled to a first printed wiring board. The heat sink assembly has an integrated circuit die coupled to a second printed wiring board. Preferably, the heat sink assembly and the chip scale package assembly are assembled separately then assembled together. The circuit pads on the first printed wiring board correspond with circuit pads on the second printed wiring board. The circuit pads may be coupled together by solder or adhesive bonding. The circuit pads on the first printed wiring board may have solder balls formed of high temperature solder that do not melt when the heat sink assembly is assembled with chip scale package assembly. The solder balls allow chip scale package assembly to maintain a predetermined distance from the circuit pads on the second printed wiring board.
    Type: Application
    Filed: February 16, 2000
    Publication date: November 29, 2001
    Inventors: C. P. Lo, Daniel A. Huang, Pete Hudson