Patents by Inventor Pete Loeppert

Pete Loeppert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRESSURE SENSING APPARATUS WITH MEMS
    Publication number: 20230288281
    Abstract: In accordance with one aspect, a device is provided having a transducer comprising a conductor, a diaphragm configured to move relative to the conductor, and a reference volume in communication with the external environment. The diaphragm separates the reference volume and the external environment. The device further includes a controller operably coupled to the transducer and configured to determine an air pressure of an external environment based at least in part on movement of the diaphragm.
    Type: Application
    Filed: March 15, 2023
    Publication date: September 14, 2023
    Applicant: Knowles Electronics, LLC
    Inventors: Andy Unruh, Sung Bok Lee, Pete Loeppert, Wade Conklin, Michael Kuntzman, Vahid Naderyan
  • PRESSURE SENSING APPATUS WITH MEMS
    Publication number: 20210239559
    Abstract: In accordance with one aspect, a device is provided having a transducer comprising a conductor, a diaphragm configured to move relative to the conductor, and a reference volume in communication with the external environment. The diaphragm separates the reference volume and the external environment. The device further includes a controller operably coupled to the transducer and configured to determine an air pressure of an external environment based at least in part on movement of the diaphragm.
    Type: Application
    Filed: July 24, 2017
    Publication date: August 5, 2021
    Applicant: Knowles Electronics, LLC
    Inventors: Andy Unruh, Sung Bok Lee, Pete Loeppert, Wade Conklin, Michael Kuntzman, Vahid Naderyan
  • Transducer package with through-vias
    Patent number: 10206023
    Abstract: A microphone includes a microelectromechanical system (MEMS) die configured to sense an acoustic signal, a base, and a lid. The base has a top surface and a bottom surface. The bottom surface includes a first electrical pad and a second electrical pad. The first electrical pad and the second electrical pad are configured to transmit an electrical signal indicative of the acoustic signal. The lid has a top surface and a bottom surface. The lid includes a cavity that surrounds the MEMS die. The top surface of the lid includes a third electrical pad and a fourth electrical pad. The first electrical pad and the third electrical pad are electrically connected, and the second electrical pad and the fourth electrical pad are electrically connected.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: February 12, 2019
    Assignee: Knowles Electronics, LLC
    Inventor: Pete Loeppert
  • TRANSDUCER PACKAGE WITH THROUGH-VIAS
    Publication number: 20180014099
    Abstract: A microphone includes a microelectromechanical system (MEMS) die configured to sense an acoustic signal, a base, and a lid. The base has a top surface and a bottom surface. The bottom surface includes a first electrical pad and a second electrical pad. The first electrical pad and the second electrical pad are configured to transmit an electrical signal indicative of the acoustic signal. The lid has a top surface and a bottom surface. The lid includes a cavity that surrounds the MEMS die. The top surface of the lid includes a third electrical pad and a fourth electrical pad. The first electrical pad and the third electrical pad are electrically connected, and the second electrical pad and the fourth electrical pad are electrically connected.
    Type: Application
    Filed: July 6, 2016
    Publication date: January 11, 2018
    Applicant: Knowles Electronics, LLC
    Inventor: Pete Loeppert