Abstract: A method and apparatus for laterally urging two semiconductor chips, dies or wafers into an improved state of registration with each other, the method and apparatus employing microstructures comprising: a first microstructure disposed on a first major surface of a first one of said two semiconductor chips, dies or wafers, wherein the first microstructure includes a sidewall which is tapered thereby disposing it at an acute angle compared to a perpendicular of said first major surface, and a second microstructure disposed on a first surface of a second one of said two semiconductor chips, dies or wafers, wherein the shape of the second microstructure is complementary to, and mates with or contacts, in use, the first microstructure, the second microstructure including a surface which contacts said sidewall when the first and second microstructures are mated or being mated, the sidewall of the first microstructure and the surface of the second microstructure imparting a lateral force for urging the two semicondu

Abstract: A temporary bond method and apparatus for allowing wafers, chips or chiplets. To be tested, the temporary bond method and apparatus comprising: a temporary connection apparatus having one of more knife-edged microstructures, wherein the temporary connection apparatus serves, in use, as a probe device for probing the chiplets, each chiplet including a die having one or more flat contact pads which mate with the one of more knife-edged microstructures of the temporary connection apparatus; a press apparatus for applying pressure between the one or more flat contact pads on the chiplet with the one of more knife-edged microstructures of the temporary connection apparatus thereby forming a temporary bond between the temporary connection pad with the knife-edged microstructure in contact with the one or more flat wafer pads; the press being able to apply a pressure to maintain the temporary bond connection during or prior to testing of the chiplet.

Abstract: A method of bonding a double-ended cable to a multi-tier substrate (such as a multi-tier printed circuit board) includes picking up the double-ended cable, and imaging alignment markers on a first head of the double-ended cable, a second substrate of the multi-tier substrate, a second head of the double-ended cable, and a first substrate of the multi-tier substrate. The method also includes aligning the alignment marker on the first head of the cable to the alignment marker on the second substrate of the multi-tier substrate, coupling the first head of the cable to the second substrate, and releasing the first head of the cable. The method further includes aligning the alignment marker on the second head of the cable to the alignment marker on the first substrate of the multi-tier substrate, coupling the second head of the cable to the first substrate, and releasing the second head of the cable.

Abstract: A temporary bond method and apparatus for allowing wafers, chips or chiplets. To be tested, the temporary bond method and apparatus comprising: a temporary connection apparatus having one of more knife-edged microstructures, wherein the temporary connection apparatus serves, in use, as a probe device for probing the chiplets, each chiplet including a die having one or more flat contact pads which mate with the one of more knife-edged microstructures of the temporary connection apparatus; a press apparatus for applying pressure between the one or more flat contact pads on the chiplet with the one of more knife-edged microstructures of the temporary connection apparatus thereby forming a temporary bond between the temporary connection pad with the knife-edged microstructure in contact with the one or more flat wafer pads; the press being able to apply a pressure to maintain the temporary bond connection during or prior to testing of the chiplet.

Abstract: An electronic apparatus comprising one or more microstructures on a substrate and a method for fabricating the electronic apparatus. The microstructures have alignment structures that allow the microstructures to be oriented in receptacles having shapes that are complementary to the shapes of the alignment structures. The alignment structures are shapes that vary when rotated 360°, such that the microstructures are positioned at a specific orientation in the receptacles.

Abstract: An integrated communication device having a substrate layer of substantially electrically nonconductive material with two substantially parallel surfaces, an antenna element disposed on one of the surfaces, a ground layer of substantially electrically conductive material disposed on the other surface and having an opening formed therethrough opposite from the antenna element, and a transceiver device mounted to the ground layer to transmit and/or receive electromagnetic energy through the opening.

Abstract: A conformal retro-modulator optical apparatus. The apparatus includes an array of multiple quantum well devices disposed in a thin array. A plastic support element is bonded to the thin array, the plastic support element having a thickness greater that of the thin array. The plastic support element is preferably plastic at elevated temperatures above room temperature, thereby allowing the plastic support element and the thin array of multiple well device disposed therein to conform to a predetermined shape, yet being rigid at room temperature.

Abstract: A method for removing defects from a semiconductor surface is disclosed. The surface of the semiconductor is first coated with a protective layer, which is later thinned to selectively reveal portions of the protruding defects. The defects are then removed by etching. Finally, also the protective layer is removed. According to the method, inadvertent thinning of the surface is prevented and removal of the defects is obtained.

Abstract: A concentrator for detecting biological and/or chemical materials in an environment. The concentrator comprises an engineered superlattice structure having alternating layers of elemental, binary or ternary group III-group V, or group IV-group IV semiconducting materials. A method for detecting biological and/or chemical materials in an environment using the concentrator. The method comprising exposing the concentrator to the biological and/or chemical materials in an environment and activating the superlattice structure optically or electrically followed by the detection of the biological and/or chemical materials.

Abstract: The invention relates to a dispensing device which can be used to dispense a metered volume of a flowable material such as a liquid, gel or paste product from a reservoir. The invention provides a pump (101) for dispensing a flowable material from a container, the pump including a pump body (102) which is deformable between a rest configuration and a squeezed configuration, the internal capacity of the pump body being substantially reduced in the squeezed configuration compared to the rest configuration. The pump includes a unidirectional valve to allow ingress of the flowable material into the pump body from the container and an outlet (104) to allow egress of flowable material from the pump body such that squeezing of the pump body dispenses the flowable material from the container. The pump assembly includes a sealing member (130) located within the pump body and mounted for translational movement.

Abstract: A process for treating impure cane-derived sugar juice comprises subjecting, in a clarification stage, the juice to microfiltration/ultrafiltration to decrease the levels of suspended solids, organic non-sugar impurities and/or color therein. The resultant clarified sugar juice is sequentially passed through an ion exchange stage by bringing the juice into contact with a strong acid cation ion exchange resin in the hydrogen form, and thereafter into contact with an anion ion exchange resin in the hydroxide form. A purified sugar solution is withdrawn from the ion exchange stage, and concentrated to produce a syrup. The syrup is subjected to primary crystallization in a primary crystallization stage, to produce refined white sugar and primary mother liquor. The primary mother liquor is subjected to secondary crystallization in a secondary crystallization stage, to produce impure crystallized sugar and white strap molasses.