Patents by Inventor Peter A. Gits

Peter A. Gits has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5601678
    Abstract: A method of forming a multi-layer circuit board which includes electrical interconnections between adjacent circuit board layers of the multi-layer board. A via hole is provided through a circuit board layer. The via hole is filled with a via metal. The via metal is plated with a low melting point metal. An adhesive film is deposited over the circuit board layer. Adjacent layers of the multi-layer circuit board are stacked and aligned together. The layers are laminated under heat and pressure. The low melting point metal provides an electrical interconnection between adjacent layers.
    Type: Grant
    Filed: January 23, 1995
    Date of Patent: February 11, 1997
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Joel A. Gerber, Peter A. Gits
  • Patent number: 5401913
    Abstract: A multi-layer circuit board includes electrical interconnections between adjacent circuit board layers of the multi-layer board. A via hole is provided through a circuit board layer. The via hole is filled with a via metal. The via metal is plated with a low melting point metal. An adhesive film is deposited over the circuit board layer. Adjacent layers of the multi-layer circuit board are stacked and aligned together. The layers are laminated under heat and pressure. The low melting point metal provides an electrical interconnection between adjacent layers.
    Type: Grant
    Filed: June 8, 1993
    Date of Patent: March 28, 1995
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Joel A. Gerber, Peter A. Gits