Abstract: In a method of controlling a lithography-based additive manufacturing device capable of manufacturing a three-dimensional component from a plurality of volume elements, a check is made to determine whether the volume elements are entirely within the three-dimensional virtual model by identifying at least first and second boundary points of the volume element or virtual model in x-y planes spaced apart in the z-direction, and the volume element in question is provided for the manufacturing process only if it is within the model with respect to the first and second boundary points.

Abstract: A method of producing a test body for diffusion tensor imaging, which comprises a plurality of channels in a structuring material, the channels preferably having a maximum cross-section of 625 ?m2, wherein a virtual model of the test body is created and the virtual model is fed to a structuring device which produces the test body by means of a 3D printing-based, in particular lithography-based, structuring process, the structuring process being designed as a multiphoton lithography process, in particular as a multiphoton absorption process, in which the structuring material containing a photosensitizer or photoinitiator is irradiated in a location-selective manner, wherein the radiation is successively focused on focal points lying within the structuring material, resulting in that in each case a volume element of the material located in the focal point is subjected to a change in state by means of a photochemical reaction as a result of multiphoton absorption.

Abstract: In a method for the lithography-based generative production of a three-dimensional component, in which electromagnetic radiation emitted by an irradiation device is successively focused on focal points within a material, wherein in each case a volume element of the material located at the focal point is solidified by means of multiphoton absorption, wherein a substructure is each built up from the volume elements in a writing area of the irradiation device, the build-up of the component comprises the following steps: a) a plurality of substructures are arranged next to one another, then b) substructures are arranged one above the other so that upper substructures bridge the interface(s) between lower substructures arranged next to one another.

Abstract: In a method for the lithography-based generative manufacturing of a three-dimensional component, in which at least one beam emitted by an electromagnetic radiation source is successively focused by means of an irradiation device onto focal points within a material, as a result of which in each case a volume element of the material located at the focal point is solidified by means of multiphoton absorption, the focal point is displaced in a z-direction, the z-direction corresponding to a direction of irradiation of the at least one beam into the material, the displacement of the focal point in the z-direction being effected by means of at least one acousto-optical deflector arranged in the beam path, in which a sound wave is generated, the frequency of which is periodically modulated.

Abstract: Apparatus and methods are disclosed for transferring solder to a substrate. A substrate belt moves one or more substrates in a belt direction. A decal has one or more through holes in a hole pattern that hold solder. Each of the solder holes can align with respective locations on one of the substrates. An ultrasonic head produces an ultrasonic vibration in the solder in a longitudinal direction perpendicular to the belt direction. The ultrasonic head and substrate can be moved together in the longitudinal direction to maintain the ultrasonic head in contact with the solder while the ultrasonic head applies the ultrasonic vibration. Various methods are disclosed including methods of transferring the solder with or without external heating.

Abstract: In a method for the lithography-based generative production of a three-dimensional component, in which electromagnetic radiation emitted by an irradiation device is successively focused on focal points within a material, wherein in each case a volume element of the material located at the focal point is solidified by means of multiphoton absorption, wherein a substructure is each built up from the volume elements in a writing area of the irradiation device, the build-up of the component comprises the following steps: a) a plurality of substructures are arranged next to one another, then b) substructures are arranged one above the other so that upper substructures bridge the interface(s) between lower substructures arranged next to one another.

Abstract: A method of producing a test body for diffusion tensor imaging, which comprises a plurality of channels in a structuring material, the channels preferably having a maximum cross-section of 625 ?m2, wherein a virtual model of the test body is created and the virtual model is fed to a structuring device which produces the test body by means of a 3D printing-based, in particular lithography-based, structuring process, the structuring process being designed as a multiphoton lithography process, in particular as a multiphoton absorption process, in which the structuring material containing a photosensitizer or photoinitiator is irradiated in a location-selective manner, wherein the radiation is successively focused on focal points lying within the structuring material, resulting in that in each case a volume element of the material located in the focal point is subjected to a change in state by means of a photochemical reaction as a result of multiphoton absorption.

Abstract: Protruding solder structures are created for electrical attachment of semiconductor devices. A rigid mold having one or more mold openings is attached to and used in combination with a decal structure that has one or more decal holes. The decal structure is disposed on the rigid mold so that the decal openings are aligned over the mold openings. Each of the decal hole and mold opening in contact form a single combined volume. The single combined volumes are filled with solder to form protruding solder structures. Various structures and methods of making and using the structures are disclosed.

Abstract: The invention relates to solid medicinal forms containing at least one active ingredient and at least one pharmaceutically compatible, water soluble drying agent which is selected from the group consisting of trimagnesium dicitrate and/or calcium chloride, the solid medicinal form having a drying loss of at most 6% and a relative equilibrium moisture content of 25% or less. The invention also relates to solid medicinal forms containing a moisture-sensitive active ingredient and trimagnesium dicitrate.

Abstract: In an Injection Molded Soldering system, a single, one-layer decal has one or more through hole patterns where each through hole pattern has a plurality of through holes through the decal. A drum with a drum circumference turns while the decal is forced to be adjacent to the drum circumference. The decal passes by a tangent point on the drum circumference where one or more solder-filled through hole patterns align with recessed openings on a substrate at the tangent point of the drum circumference. Applied heat causes the solder structures to melt and flow into the recessed openings.

Abstract: Apparatus and methods are disclosed for transferring solder to a substrate. A substrate belt moves one or more substrates in a belt direction. A decal has one or more through holes in a hole pattern that hold solder. Each of the solder holes can align with respective locations on one of the substrates. An ultrasonic head produces an ultrasonic vibration in the solder in a longitudinal direction perpendicular to the belt direction. The ultrasonic head and substrate can be moved together in the longitudinal direction to maintain the ultrasonic head in contact with the solder while the ultrasonic head applies the ultrasonic vibration. Various methods are disclosed including methods of transferring the solder with or without external heating.

Abstract: Protruding solder structures are created for electrical attachment of semiconductor devices. A rigid mold having one or more mold openings is attached to and used in combination with a decal structure that has one or more decal holes. The decal structure is disposed on the rigid mold so that the decal openings are aligned over the mold openings. Each of the decal hole and mold opening in contact form a single combined volume. The single combined volumes are filled with solder to form protruding solder structures. Various structures and methods of making and using the structures are disclosed.

Abstract: A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits.

Abstract: In an Injection Molded Soldering system, a single, one-layer decal has one or more through hole patterns where each through hole pattern has a plurality of through holes through the decal. A drum with a drum circumference turns while the decal is forced to be adjacent to the drum circumference. The decal passes by a tangent point on the drum circumference where one or more solder-filled through hole patterns align with recessed openings on a substrate at the tangent point of the drum circumference. Applied heat causes the solder structures to melt and flow into the recessed openings.

Abstract: The invention relates to solid medicinal forms containing at least one active ingredient and at least one pharmaceutically compatible, water soluble drying agent which is selected from the group consisting of trimagnesium dicitrate and/or calcium chloride, the solid medicinal form having a drying loss of at most 6% and a relative equilibrium moisture content of 25% or less. The invention also relates to solid medicinal forms containing a moisture-sensitive active ingredient and trimagnesium dicitrate.

Abstract: A system of producing metal cored solder structures on a substrate includes: a decal, a carrier, and receiving elements. The decal includes one or more apertures each of which is tapered from a top surface to a bottom surface thereof. The carrier is positioned beneath the bottom of the decal and includes cavities in a top surface. The cavities are located in alignment with the apertures of the decal. The decal is positioned on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities. The feature cavities are shaped to receive one or more metal elements and are configured for receiving molten solder cooled in the cavities. The decal is separable from the carrier to partially expose metal core solder contacts. The receiving elements receive the metal core solder contacts thereon.

Abstract: The invention relates to solid medicinal forms containing at least one active ingredient and at least one pharmaceutically compatible, water soluble drying agent which is selected from the group consisting of trimagnesium dicitrate and/or calcium chloride, the solid medicinal form having a drying loss of at most 6% and a relative equilibrium moisture content of 25% or less. The invention also relates to solid medicinal forms containing a moisture-sensitive active ingredient and trimagnesium dicitrate.

Abstract: A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits.

Abstract: A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits.

Abstract: In a method for lithography-based generative production of three-dimensional components, in which material that can be solidified under the effect of electromagnetic radiation is arranged in a vat, a build platform is positioned at a distance from the vat bottom, material located between the build platform and the vat bottom is irradiated at selected locations with the aid of an irradiating unit, the electromagnetic radiation is introduced into the material from below through a vat bottom that is transmissive to the radiation, at least in a certain region, and successively focused on focal points within the material, whereby a volume element of the material that is respectively located at the focal point is solidified. The solidification takes place by means of multiphoton absorption and the volume of the focal point is varied at least once during the method, and so the component is built up from solidified volume elements of different volumes.