Patents by Inventor Peter A. Jerome
Peter A. Jerome has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240148179Abstract: A tray assembly includes a tray having a top side, an underside opposite the top side, and a plurality of protrusions extending from the underside. Each protrusion defines a recess in the top side and has a bottom wall and a contoured surface connecting the bottom wall to the top side. The tray assembly also includes a diffuser in the form of a plate with a plurality of apertures therethrough. The diffuser is couplable to the tray and positionable a spaced distance above the top side of the tray.Type: ApplicationFiled: August 21, 2023Publication date: May 9, 2024Inventors: James Kelly Pool, III, Peter Jerome Ashcraft
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Publication number: 20240145504Abstract: A semiconductor device may include a plurality of single-photon avalanche diode (SPAD) pixels. The semiconductor device may be a backside device having a substrate at the backside, dielectric layers on the substrate, metal layers interleaved with the dielectric layers, and a through silicon via (TSV) formed in the backside through the substrate and the dielectric layers. TSV seal rings may be formed around the TSV to protect the semiconductor device from moisture and/or water ingress. The TSV seal rings may be coupled to a high-voltage cathode bond pad and be coupled to offset portions of one of the metal layers to reduce leakage and/or parasitic effects due to the voltage difference between the cathode and the substrate. The TSV seal rings may also be merged with die seal rings at the edge of the substrate.Type: ApplicationFiled: November 1, 2022Publication date: May 2, 2024Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Jeffrey Peter GAMBINO, Rick Carlton JEROME, David T. PRICE, Michael Gerard KEYES, Anne DEIGNAN
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Patent number: 11730303Abstract: A tray assembly includes a tray having a top side, an underside opposite the top side, and a plurality of protrusions extending from the underside. Each protrusion defines a recess in the top side and has a bottom wall and a contoured surface connecting the bottom wall to the top side. The tray assembly also includes a diffuser in the form of a plate with a plurality of apertures therethrough. The diffuser is couplable to the tray and positionable a spaced distance above the top side of the tray.Type: GrantFiled: June 27, 2019Date of Patent: August 22, 2023Assignee: CookTek Induction Systems, LLCInventors: James Kelly Pool, III, Peter Jerome Ashcraft
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Publication number: 20220317402Abstract: A telecommunications enclosure is disclosed. In one example the enclosure includes a gel block actuator that is capable of applying compressive load and positive tensile load to the gel block.Type: ApplicationFiled: April 11, 2022Publication date: October 6, 2022Applicant: CommScope Connectivity Belgium BVBAInventors: Mohamed AZNAG, Pieter DOULTREMONT, Maarten AERTS, Maddy Nadine FREDERICKX, Deon Craig SYLVESTER, Peter Jerome ISTAS, El Möiz Mohammed Michel GHAMMAM, Samory DE ZITTER, William Alan CARRICO, Jos Paul G. VANDEPOEL, Wouter ANNAERT
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Publication number: 20220157657Abstract: Embodiments of the invention include a method of singulating IC chips from a wafer. The method can include receiving the wafer having a substrate formed under active layers. The wafer includes a chip that includes a first portion of the active layers and a first portion of the substrate. A separation trench is formed by using an etch operation to remove a first segment of the active layers and a first segment of the substrate that are beneath a first separation channel of the wafer. The separation trench separates the first portion of the active layers from a remaining portion of the active layers; and separates the first portion of the substrate from a remaining portion of the substrate. The first IC chip is seperated from the wafer by removing a first section of the remaining portion of the substrate that is underneath the first portion of the substrate.Type: ApplicationFiled: November 13, 2020Publication date: May 19, 2022Inventors: Cyril Cabral, JR., Frank Robert Libsch, Chitra Subramanian, Peter Jerome Sorce, Paul Alfred Lauro, John M. Papalia
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Patent number: 11327265Abstract: A clamp assembly includes a first clamp half-piece and a second clamp half-piece. In one example, the clamp half-pieces are identically shaped. In one example, each of the clamp half-pieces has at least one integral pin and at least one aperture. The first and second clamp half-pieces are pivotally connected to each other via a first snap-fit interface in which the integral pin of the first clamp half-piece snap-fits into the at least one aperture of the second clamp half-piece. The clamp assembly can also include a link arm connected to the first clamp half-piece via a second snap-fit interface. A lever arm can also be included that is pivotally connected to the link arm via a third snap-fit interface. The clamp assembly does not require separate link pins or other parts and only includes four components: the clamp half-pieces, the link arm, and the lever arm.Type: GrantFiled: August 25, 2020Date of Patent: May 10, 2022Assignee: CommScope Connectivity Belgium BVBAInventors: Thierry Janssens, Robert Vanhentenrijk, Kurt Cornelissen, Thomas Dietvorst, James Richard, Peter Jerome Istas
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Patent number: 11300745Abstract: A telecommunications enclosure is disclosed. In one example the enclosure includes a gel block actuator that is capable of applying compressive load and positive tensile load to the gel block.Type: GrantFiled: June 23, 2018Date of Patent: April 12, 2022Assignee: COMMSCOPE CONNECTIVITY BELGIUM BVBAInventors: Mohamed Aznag, Pieter Doultremont, Maarten Aerts, Maddy Nadine Frederickx, Deon Craig Sylvester, Peter Jerome Istas, El Möiz Mohammed Michel Ghammam, Samory De Zitter, William Alan Carrico, Jos Paul G. Vandepoel, Wouter Annaert
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Patent number: 11073673Abstract: A cable fixation device (100, 200, 300, 400) includes a base (102, 202) with fastener holes (104), an upright (110, 208) projecting from the base and including a fixation projection (126, 212, 316, 318) having a reduced dimensional portion (128, 214, 324) for receiving a cable tie (152, 222, 326). Protrusions (130, 218, 320) are provided for engaging the cable jacket. Variations on the cable fixation device include a fixation element (130, 218, 320) which can slide and/or rotate about a vertical rod; a plate element (304) which includes a plurality of fixation projections extending between two rods; and a plurality of uprights (208) integrally formed with the base and including forwardly and rearwardly projecting projections. The base (102, 202) and the fixation projections (126, 212, 316, 318) can be made from molded plastic.Type: GrantFiled: December 23, 2019Date of Patent: July 27, 2021Assignees: CommScope Connectivity Belgium BVBA, ADC Czech Republic, S.R.O.Inventors: Karel An Johan Jaksons, Eric Schurmans, Peter Jerome Istas, Jiri Zavrel, Denys Mizin, Jiri Pasek, Jiri Ambroz, Ales Smisek
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Publication number: 20210041654Abstract: A clamp assembly includes a first clamp half-piece and a second clamp half-piece. In one example, the clamp half-pieces are identically shaped. In one example, each of the clamp half-pieces has at least one integral pin and at least one aperture. The first and second clamp half-pieces are pivotally connected to each other via a first snap-fit interface in which the integral pin of the first clamp half-piece snap-fits into the at least one aperture of the second clamp half-piece. The clamp assembly can also include a link arm connected to the first clamp half-piece via a second snap-fit interface. A lever arm can also be included that is pivotally connected to the link arm via a third snap-fit interface. The clamp assembly does not require separate link pins or other parts and only includes four components: the clamp half-pieces, the link arm, and the lever arm.Type: ApplicationFiled: August 25, 2020Publication date: February 11, 2021Inventors: Thierry Janssens, Robert Vanhentenrijk, Kurt Cornelissen, Thomas Dietvorst, James Richard, Peter Jerome Istas
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Publication number: 20210028138Abstract: In an embodiment, a method for forming a solder bump includes preparing a transfer mold having a solder pillar extending from a mold substrate and through a first photoresist layer and having a shape partially defined by a second photoresist layer that is removed prior to transfer of the solder. In an embodiment, the mold substrate is flexible. In an embodiment, the transfer mold is flexible. In an embodiment, the method includes providing a device substrate having a wettable pad. In an embodiment, the method includes placing the transfer mold and the device substrate into aligned contact such that the solder pillar is in contact with the wettable pad. In an embodiment, the method includes forming a metallic bond between the solder pillar and the wettable pad. In an embodiment, the method includes removing the mold substrate and first photoresist layer.Type: ApplicationFiled: August 11, 2020Publication date: January 28, 2021Applicant: International Business Machines CorporationInventors: Eric Peter Lewandowski, Jae-Woong Nah, Jeng-Bang Yau, Peter Jerome Sorce
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Publication number: 20200405087Abstract: A tray assembly includes a tray having a top side, an underside opposite the top side, and a plurality of protrusions extending from the underside. Each protrusion defines a recess in the top side and has a bottom wall and a contoured surface connecting the bottom wall to the top side. The tray assembly also includes a diffuser in the form of a plate with a plurality of apertures therethrough. The diffuser is couplable to the tray and positionable a spaced distance above the top side of the tray.Type: ApplicationFiled: June 27, 2019Publication date: December 31, 2020Inventors: James Kelly Pool, III, Peter Jerome Ashcraft
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Patent number: 10879202Abstract: In an embodiment, a method for forming a solder bump includes preparing a transfer mold having a solder pillar extending from a mold substrate and through a first photoresist layer and having a shape partially defined by a second photoresist layer that is removed prior to transfer of the solder. In an embodiment, the mold substrate is flexible. In an embodiment, the transfer mold is flexible. In an embodiment, the method includes providing a device substrate having a wettable pad. In an embodiment, the method includes placing the transfer mold and the device substrate into aligned contact such that the solder pillar is in contact with the wettable pad. In an embodiment, the method includes forming a metallic bond between the solder pillar and the wettable pad. In an embodiment, the method includes removing the mold substrate and first photoresist layer.Type: GrantFiled: July 26, 2019Date of Patent: December 29, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Eric Peter Lewandowski, Jae-Woong Nah, Jeng-Bang Yau, Peter Jerome Sorce
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Patent number: 10761286Abstract: A clamp assembly includes a first clamp half-piece and a second clamp half-piece. In one example, the clamp half-pieces are identically shaped. In one example, each of the clamp half-pieces has at least one integral pin and at least one aperture. The first and second clamp half-pieces are pivotally connected to each other via a first snap-fit interface in which the integral pin of the first clamp half-piece snap-fits into the at least one aperture of the second clamp half-piece. The clamp assembly can also include a link arm connected to the first clamp half-piece via a second snap-fit interface. A lever arm can also be included that is pivotally connected to the link arm via a third snap-fit interface. The clamp assembly does not require separate link pins or other parts and only includes four components: the clamp half-pieces, the link arm, and the lever arm.Type: GrantFiled: March 22, 2019Date of Patent: September 1, 2020Assignee: CommScope Connectivity Belgium BVBAInventors: Thierry Janssens, Robert Vanhentenrijk, Kurt Cornelissen, Thomas Dietvorst, James Richard, Peter Jerome Istas
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Publication number: 20200249407Abstract: A telecommunications enclosure is disclosed. In one example the enclosure includes a gel block actuator that is capable of applying compressive load and positive tensile load to the gel block.Type: ApplicationFiled: June 23, 2018Publication date: August 6, 2020Applicant: CommScope Connectivity Belgium BVBAInventors: Mohamed AZNAG, Pieter DOULTREMONT, Maarten AERTS, Maddy Nadine FREDERICKX, Deon Craig SYLVESTER, Peter Jerome ISTAS, El Möiz Mohammed Michel GHAMMAM, Samory DE ZITTER, William Alan CARRICO, Jos Paul G. VANDEPOEL, Wouter ANNAERT
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Publication number: 20200241229Abstract: A cable fixation device (100, 200, 300, 400) includes a base (102, 202) with fastener holes (104), an upright (110, 208) projecting from the base and including a fixation projection (126, 212, 316, 318) having a reduced dimensional portion (128, 214, 324) for receiving a cable tie (152, 222, 326). Protrusions (130, 218, 320) are provided for engaging the cable jacket. Variations on the cable fixation device include a fixation element (130, 218, 320) which can slide and/or rotate about a vertical rod; a plate element (304) which includes a plurality of fixation projections extending between two rods; and a plurality of uprights (208) integrally formed with the base and including forwardly and rearwardly projecting projections. The base (102, 202) and the fixation projections (126, 212, 316, 318) can be made from molded plastic.Type: ApplicationFiled: December 23, 2019Publication date: July 30, 2020Applicants: COMMSCOPE CONNECTIVITY BELGIUM BVBA, ADC CZECH REPUBLIC, S.R.O.Inventors: Karel An Johan JAKSONS, Eric SCHURMANS, Peter Jerome ISTAS, Jiri ZAVREL, Denys MIZIN, Jiri PASEK, Jiri AMBROZ, Ales SMISEK
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Patent number: 10520695Abstract: A cable fixation device (100, 200, 300, 400) includes a base (102, 202) with fastener holes (104), an upright (110, 208) projecting from the base and including a fixation projection (126, 212, 316, 318) having a reduced dimensional portion (128, 214, 324) for receiving a cable tie (152, 222, 326). Protrusions (130, 218, 320) are provided for engaging the cable jacket. Variations on the cable fixation device include a fixation element (130, 218, 320) which can slide and/or rotate about a vertical rod; a plate element (304) which includes a plurality of fixation projections extending between two rods; and a plurality of uprights (208) integrally formed with the base and including forwardly and rearwardly projecting projections. The base (102, 202) and the fixation projections (126, 212, 316, 318) can be made from molded plastic.Type: GrantFiled: December 18, 2014Date of Patent: December 31, 2019Assignees: CommScope Connectivity Belgium BVBA, ADC Czech Republic, S.R.O.Inventors: Karel An Johan Jaksons, Eric Schurmans, Peter Jerome Istas, Jiri Zavrel, Denys Mizin, Jiri Pasek, Jiri Ambroz, Ales Smisek
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Publication number: 20190285821Abstract: A clamp assembly includes a first clamp half-piece and a second clamp half-piece. In one example, the clamp half-pieces are identically shaped. In one example, each of the clamp half-pieces has at least one integral pin and at least one aperture. The first and second clamp half-pieces are pivotally connected to each other via a first snap-fit interface in which the integral pin of the first clamp half-piece snap-fits into the at least one aperture of the second clamp half-piece. The clamp assembly can also include a link arm connected to the first clamp half-piece via a second snap-fit interface. A lever arm can also be included that is pivotally connected to the link arm via a third snap-fit interface. The clamp assembly does not require separate link pins or other parts and only includes four components: the clamp half-pieces, the link arm, and the lever arm.Type: ApplicationFiled: March 22, 2019Publication date: September 19, 2019Inventors: Thierry Janssens, Robert Vanhentenrijk, Kurt Cornelissen, Thomas Dietvorst, James Richard, Peter Jerome Istas
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Patent number: 10274691Abstract: A clamp assembly includes a first clamp half-piece and a second clamp half-piece. In one example, the clamp half-pieces are identically shaped. In one example, each of the clamp half-pieces has at least one integral pin and at least one aperture. The first and second clamp half-pieces are pivotally connected to each other via a first snap-fit interface in which the integral pin of the first clamp half-piece snap-fits into the at least one aperture of the second clamp half-piece. The clamp assembly can also include a link arm connected to the first clamp half-piece via a second snap-fit interface. A lever arm can also be included that is pivotally connected to the link arm via a third snap-fit interface. The clamp assembly does not require separate link pins or other parts and only includes four components: the clamp half-pieces, the link arm, and the lever arm.Type: GrantFiled: November 4, 2016Date of Patent: April 30, 2019Assignee: CommScope Connectivity Belgium BVBAInventors: Thierry Janssens, Robert Vanhentenrijk, Kurt Cornelissen, Thomas Dietvorst, James Richard, Peter Jerome Istas
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Patent number: D931056Type: GrantFiled: November 27, 2019Date of Patent: September 21, 2021Assignee: Keurig Green Mountain, Inc.Inventors: Keith Paul Thompson, Matthew John Maitland, Iain James Sabberton, Peter David Cauwood, Peter Jerome Warren, Hongchuan Zhu, Bo Ma, Joel Swerchesky
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Patent number: D1019394Type: GrantFiled: February 22, 2023Date of Patent: March 26, 2024Assignee: BLUETRITON BRANDS, INC.Inventors: David Jerome Hutts, Christopher P. Nanos, Lauren Webber, Ryan Boudreaux, Peter Brian Clarke, Trond Erik Tollefsen