Abstract: This invention pertains to alkyl substituted bi(cyclohexylamine) and derivatives having a high trans, trans-isomer distribution. This isomer distribution represents a thermodynamic mixture of the isomers and provides for extended pot life and extended thermal properties in epoxy resins which are not seen with the kinetic isomer mixture. The bridged cyclohexylamine and derivatives are represented by the formula: ##STR1## wherein; R.sup.1 is hydrogen or C.sub.1-4 alkyl;R.sup.2 is C.sub.1-4 alkyl; andR.sup.3 is hydrogen or C.sub.1-4 alkylThe invention also relates to epoxy resins cured with the bridged bi(cyclohexylamines).

Abstract: This invention pertains to epoxy resins having increased chemical resistance to solvents, and good cured mechanical properties which are prepared by curing the epoxy resins with a curing agent comprising a mixture of methylene bridged poly(cyclohexyl-aromatic)amines. The methylene bridged poly(cyclohexyl-aromatic)amine curing agents are the residue obtained from the distillation of a mixture of poly(cyclohexylaromatic)amines formed by the hydrogenation of crude methylenedianiline or crude di(4-amino-3-methylcyclohexyl)methane.

Abstract: This invention pertains to alkyl substituted bi(cyclohexylamine) and derivatives having a high trans,trans-isomer distribution. This isomer distribution represents a thermodynamic mixture of the isomers and provides for extended pot life and extended thermal properties in epoxy resins which are not seen with the kinetic isomer mixture. The bridged cyclohexylamine and derivatives are represented by the formula: ##STR1## wherein; R.sup.1 is hydrogen or C.sub.1-4 alkyl;R.sup.2 is C.sub.1-4 alkyl; andR.sup.3 is hydrogen or C.sub.1-4 alkylThe invention also relates to epoxy resins cured with the bridged bi(cyclohexylamines).

Abstract: This invention relates to ditertiary-butyl substituted bridged di(cyclohexylamines) where the tert-butyl substituent is alpha to the amine group and to polyepoxide formulations incorporating the di(cyclohexylamine). The formula of the diamine is: ##STR1## wherein R is tert-butyl. The di(tertiary butyl)methylene bridged cyclohexylamines have delayed reactivity when incorporated in epoxy resins and they also enhance physical properties in high resilience polyurethane foams.

Abstract: This invention relates to polyepoxide resins cured with an amine composition containing 1-methyl-2,6-cyclohexanediamine. The resulting polyepoxide resins generally are more easily processable and have improved thermal stability, greater elongation and enhanced fracture toughness.

Abstract: This invention relates to bridged cyclohexylamines represented by the formula: ##STR1## A is C.sub.0, --CH.sub.2 --, ##STR2## R.sub.1 is C.sub.1-3 alkyl R.sub.2 is C.sub.1-6 alkylR.sub.3 is C.sub.1 or C.sub.2 alkylR.sub.4 is H or C.sub.1-4 alkylx is 0 or 1y is 0 or 1These bridged bis(cyclohexylamine) derivatives are well suited as curing agents for epoxy resins. These compositions lead to enhanced processing of the epoxy resin and permit adjustment of the reactivity/performance in formulating epoxies which demonstrate superior high temperature properties.

Abstract: Polymeric compositions are prepared from ethylenically unsaturated monomeric compositions and polyarylcyanate ester compositions which have at least two arylcyanate ester moieties bridged by a polycyclic aliphatic moiety; and wherein the polyarylcyanate ester composition is substantially soluble in the ethylenically unsaturated monomeric composition.

Abstract: Laminates are prepared for reinforced expoxy resin compositions comprising (A) a reinforcing material such as fiberglass, (B) one or more epoxy resins such as a hydrocarbon-phenol eposy resin and (C) one or more epoxy resin curing agents such as a hydrocarbon-phenol resin or phenol-formaldehyde novolac resin. These laminates are particularly suitable for use in electrical applications such as the manufacture of printed circuit boards.

Abstract: Curable compositions are prepared from reinforced epoxy resin compositions comprising (A) a filler material such as silica flour, (B) one or more epoxy resins at least one of which is a hydrocarbon novolac epoxy resin such as a phenol-dicyclopentadiene epoxy novolac resin and (C) one or more epoxy resin curing agents such as phenol-formaldehyde novolac resin. These compositions are particularly suitable for use in electrical applications such as the encapsulation and subsequent protection of electrical and micro-electronic devices and circuitry and in adhesive formulations.

Abstract: The combination of n-butanol, n-hexanol and butoxyethanol, is a superior formulation solvent for aqueous dispersions of amine-neutralized, phosphorylated DGEBA-type epoxy resins which are to be applied to container interiors by spraying. Good film rheology and control of viscosity--by adjusting the solvent to organic solids ratio--is attained at total solids content as low as 20 wt. % and at VOC's as low as 3.5 lbs. per gallon.