Patents by Inventor Peter A Matturi

Peter A Matturi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor packaging containing sintering die-attach material
    Patent number: 9583453
    Abstract: Sintering die-attach materials provide a lead-free solution for semiconductor packages with superior electrical, thermal and mechanical performance to prior art alternatives. Wafer-applied sintering materials form a metallurgical bond to both semiconductor die and adherends as well as throughout the die-attach joint and do not remelt at the original process temperature. Application to either one or both sides of the wafer, as well as paste a film application are disclosed.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: February 28, 2017
    Assignee: Ormet Circuits, Inc.
    Inventors: Catherine Shearer, Michael C Matthews, Peter A Matturi, Eunsook Barber, Richard Weaver
  • SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL
    Publication number: 20140131898
    Abstract: Sintering die-attach materials provide a lead-free solution for semiconductor packages with superior electrical, thermal and mechanical performance to prior art alternatives. Wafer-applied sintering materials form a metallurgical bond to both semiconductor die and adherends as well as throughout the die-attach joint and do not remelt at the original process temperature. Application to either one or both sides of the wafer, as well as paste a film application are disclosed.
    Type: Application
    Filed: May 30, 2013
    Publication date: May 15, 2014
    Inventors: Catherine Shearer, Michael C Matthews, Peter A Matturi, Eunsook Barber, Rick Weaver