Patents by Inventor Peter A. Matturri

Peter A. Matturri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CONDUCTIVE FILM ADHESIVE
    Publication number: 20200180233
    Abstract: An inventive composition and process for formation of a conductive bonding film are disclosed. The invention combines adhesive bonding sheet technologies (e.g. die attach films, or DAFs) with the electrical and thermal conductivity performance of transient liquid phase sintered paste compositions. The invention films are characterized by high bulk thermal and electrical conductivity within the film as well as low and stable thermal and electrical resistance at the interfaces between the inventive film and metallized adherends.
    Type: Application
    Filed: February 14, 2020
    Publication date: June 11, 2020
    Inventors: Catherine A. SHEARER, Peter A. MATTURRI, Michael C. MATTHEWS
  • Electrically conductive compositions comprising non-eutectic solder alloys
    Patent number: 9005330
    Abstract: Transient liquid phase sintering compositions comprising one or more high melting point metals and one or more low melting temperature alloys are known in the art as useful compositions for creating electrically and/or thermally conductive pathways in electronic applications. The present invention provides transient liquid phase sintering compositions that employ non-eutectic low melting temperature alloys for improved sintering and metal matrix properties.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: April 14, 2015
    Assignee: Ormet Circuits, Inc.
    Inventors: Catherine Shearer, Peter A Matturri, Kenneth C Holcomb, Michael C Matthews
  • ELECTRICALLY CONDUCTIVE COMPOSITIONS COMPRISING NON-EUTECTIC SOLDER ALLOYS
    Publication number: 20140042212
    Abstract: Transient liquid phase sintering compositions comprising one or more high melting point metals and one or more low melting temperature alloys are known in the art as useful compositions for creating electrically and/or thermally conductive pathways in electronic applications. The present invention provides transient liquid phase sintering compositions that employ non-eutectic low melting temperature alloys for improved sintering and metal matrix properties.
    Type: Application
    Filed: December 31, 2012
    Publication date: February 13, 2014
    Applicant: Ormet Circuits, Inc.
    Inventors: Catherine Shearer, Peter A. Matturri, Kenneth C. Holcomb, Michael C. Matthews