Abstract: An acousto-optic modulator includes an acousto-optic bulk medium. A transducer is attached to the acousto-optic bulk medium and formed as a linear array of electrodes. A transducer driver is connected to each electrode and comprises a plurality of amplifiers connected to the electrodes such that each electrode is driven by a respective amplifier as a means to provide a low cost alternative to the use of higher power hybrid amplifiers in conventional AO device applications.

Abstract: An acousto-optic modulator includes an acousto-optic bulk medium and transducer attached to the acousto-optic bulk medium. The transducer includes an electrode circuit and plurality of piezoelectric platelet segments attached to the bulk medium and supporting the electrode circuit. The piezoelectric platelet segments are configured for reducing shear stress and susceptibility to fracture due to temperature extremes.

Abstract: A signal interface/package for MMIC components comprises a laminate of RF chips, socket carrier, wiring board and cold plate/waveguide structure. Input/output pins of the chip modules interface with feed-through connectors of the carrier. Each chip module is formed of a ceramic substrate which rests atop a heat conductive metallic baseplate. RF coupling ports extend through the baseplate. A coldplate element has a plurality of depressions and pillars, with each depression conforming with the shape of the baseplate. Printed wiring boards contain interconnect wiring layers to connect the signal pins to the outside world. The bottom surface of the coldplate defines a waveguide cavity structure.