Patents by Inventor Peter Aaen

Peter Aaen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatus for a reduced inductance wirebond array
    Publication number: 20070235855
    Abstract: A wirebond array (100) comprising a plurality of signal wires 110 and a plurality of ground wires (120) interdigitated with and substantially parallel to the set of signal wires (110). In one embodiment, each of the plurality of signal wires (110) and ground wires (120) is attached to a first semiconductor device (102) (e.g., a microwave power device). In another, each of the plurality of signal wires (110) is further attached to a package lead (104). In one embodiment, each of the plurality of ground wires (120) is further attached to a ground connection region (106) substantially coplanar with the package lead (104). Alternatively, each of the plurality of signal wires (110) is further attached to a second semiconductor device, wherein each of the plurality of ground wires (120) is further attached to the second semiconductor device.
    Type: Application
    Filed: March 29, 2006
    Publication date: October 11, 2007
    Inventors: Mario Bokatius, Peter Aaen, Brian Condie