Abstract: A thin film manufacturing apparatus is disclosed, including a liquid ejecting unit which ejects a liquid onto an object on which a film is to be formed and which forms a coating film; a first laser irradiating unit which continuously irradiates a laser light onto the coating film and which evaporates a solvent of the coating film; and a second laser irradiating unit which irradiates a laser light pulse onto the coating film of which the solvent is evaporated and which crystallizes the coating film of which the solvent is evaporated.

Abstract: The present invention relates to a method for measuring phase boundaries of a material during the machining of a workpiece (12) with a machining beam, more preferably with a laser beam, and a device that is embodied in such a way as to carry out the method. According to said method, during the machining, a machining region (13) containing the impact point of the machining beam (1) on the workpiece (12) is illuminated at least approximately coaxially to the machining beam (1) by means of additional optical radiation (2). Radiation (3) reflected by the machining region (13) is detected, parallel to an incidence direction of the optical radiation (2) or at small angle thereto, by means of an optical detector with local resolution, in order to obtain an optical reflection pattern of the machining region (13).

Abstract: The present invention relates to a method for measuring phase boundaries of a material during the machining of a workpiece (12) with a machining beam, more preferably with a laser beam, and a device that is embodied in such a way as to carry out the method. According to said method, during the machining, a machining region (13) containing the impact point of the machining beam (1) on the workpiece (12) is illuminated at least approximately coaxially to the machining beam (1) by means of additional optical radiation (2). Radiation (3) reflected by the machining region (13) is detected, parallel to an incidence direction of the optical radiation (2) or at small angle thereto, by means of an optical detector with local resolution, in order to obtain an optical reflection pattern of the machining region (13).

Abstract: In a method for cutting structural components to be joined by laser radiation that is guided by a computer-controlled manipulation system provided with a nominal path for each structural component corresponding to a joining line that is curved as a result of at least one of the structural components being three-dimensionally shaped, the structural component surfaces of the structural components including the joining line are determined measuring technologically. Based on measuring results, the nominal path corresponding to a penetration line of the structural components to be joined is calculated. A marking is formed on a first one of the structural component surfaces. When performing the cut on the structural component surface provided with the marking, the resulting cutting gap and the marking are determining measuring technologically. When a deviation of the cutting gap from the nominal path is detected, the manipulation system is controlled to correct the deviation.

Abstract: In a method for cutting structural components to be joined by laser radiation that is guided by a computer-controlled manipulation system provided with a nominal path for each structural component corresponding to a joining line that is curved as a result of at least one of the structural components being three-dimensionally shaped, the structural component surfaces of the structural components including the joining line are determined measuring technologically. Based on measuring results, the nominal path corresponding to a penetration line of the structural components to be joined is calculated. A marking is formed on a first one of the structural component surfaces. When performing the cut on the structural component surface provided with the marking, the resulting cutting gap and the marking are determining measuring technologically. When a deviation of the cutting gap from the nominal path is detected, the manipulation system is controlled to correct the deviation.

Abstract: A method for materials processing by means of plasma-inducing high-energy radiation, especially laser radiation, in which the instantaneous intensity of the plasma radiation is measured at plural locations of a vapor capillary. So that the method can also be performed with perfect welding results on workpieces of very small thickness, shapes of two spaced-apart peak intensity regions, or of another type of electromagnetic radiation emitted from the vapor capillary, and of a minimum region that can be formed between these two regions of extreme values are detected metrologically, the so detected shapes of the regions of extreme values are compared with predetermined region shapes, and control of the materials processing operation takes place as a function of deviations of the detected shapes from the predetermined region shapes.

Abstract: A method for processing workpieces by means of high-energy radiation, wherein the radiation is focused by a processing optic onto a processing site. The light radiation emanating form the workpiece is received by the same processing optic and is analyzed by a detector. An optical measurement with respect to the surface of the workpiece is performed in a processing area of the workpiece by means of an external source of measuring light, utilizing measuring light reflected from the processing area. The same processing optic is used to focus radiation onto the processing site and to receive radiation emanating from the workpiece at the processing site.

Abstract: A process for material working with plasma induced by high-energy radiati especially laser radiation, in which the radiation originating from the region of the workpiece is observed along the axis of the laser radiation focused along the axis on the workpiece as a function of the time. To obtain a measure of the penetration depth of the vapor capillary in the workpiece the process is so carried out that exclusively the cross section of the vapor capillary is observed with a depth of field encompassing the entire workpiece thickness, and that the mean value of the intensity of the plasma radiation is used as a measure of the penetration depth.

Abstract: A method of machining workpieces with a laser beam wherein the machining cess, in particular the melting depth or the through-melting distance is monitored by detecting an optical and/or acoustical signal created by an unshielded laser-induced plasma or vapor. In order to receive monitoring date which as much as possible is independent of signal variations in the process the signals are subjected to a frequency analysis and the average amplitudes (Ax, Ay) of two different frequency bands (x, y) of the analyzed frequencies are used with a predetermined calculation function to determine a rating value (B).

Abstract: A process for treating workpieces by means of laser radiation, particularly or the cutting, hole burning and material removal with respect to metallic workpieces, in which the treated site of the workpiece is monitored by a radiation detector which contributes to reducing the intensity of the laser radiation when an upper limit value is reached and to increasing it when a lower limit value is reached.