Abstract: An optical unit (10) comprising a plurality of optical elements, a receiving structure (12) with a plurality of element supports (40, 41) for receiving the optical elements. The element supports (40, 41) are in the form of a plate or shell or tube, whose dimensions are greater than the dimensions of the optical elements to be received, and is connected to another element support. At least one element support (40, 41) comprises temperature elements (43-49) that can be heated and/or cooled. The optical unit (10) furthermore comprises a control unit for driving the temperature elements (43-49) in order to locally change the temperature of the at least one element support (40, 41) so as to influence in a controlled manner the shape of the at least one element support (40, 41).

Abstract: An optical unit (10) comprising a plurality of optical elements, a receiving structure (12) with a plurality of element supports (40, 41) for receiving the optical elements. The element supports (40, 41) are in the form of a plate or shell or tube, whose dimensions are greater than the dimensions of the optical elements to be received, and is connected to another element support. At least one element support (40, 41) comprises temperature elements (43-49) that can be heated and/or cooled. The optical unit (10) furthermore comprises a control unit for driving the temperature elements (43-49) in order to locally change the temperature of the at least one element support (40, 41) so as to influence in a controlled manner the shape of the at least one element support (40, 41).

Abstract: An arrangement for photographic data marking upon a film strip passing through a photographic camera, especially a high-speed theodolite camera, while utilizing a perforated mask and luminescent diodes carried by a substrate. In accordance with the invention, the arrangement is structured as an integrated component which contains at least the substrate, the semiconductor bodies of the luminescent diodes, the perforated mask and a transparent cover plate. The perforated mask is fixedly connected at the side confronting the film strip with the inner side or face of the cover plate. The semiconductor bodies which are electrically connected by electrical connections with one another and with the substrate are arranged at a slight spacing from the other side or face of the perforated mask.