Patents by Inventor Peter Adrianus Jacbus Dirks

Peter Adrianus Jacbus Dirks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated Circuit Device Package with an Additional Contact Pad, a Lead Frame and an Electronic Device
    Publication number: 20080197464
    Abstract: A semiconductor device package (10) comprising: a die attach pad (12); a plurality of contact pads provided in at least four rows at least two tie bars (18) for supporting the die attach pad; a semiconductor die mounted on the top surface of the die attach pad (12) and having bond pads formed thereon; a plurality of electrical connections between selected ones of the bond pads (44) and corresponding ones of the contact pads; an encapsulation (28) leaving the bottom surface of the die attach pad and the bottom surface of the contact pads exposed; characterized by an additional contact pad (30) formed by replacing one of the tie bars (18), with the additional contact pad leaving at least one tie bar for supporting the die attach pad (12).
    Type: Application
    Filed: February 15, 2006
    Publication date: August 21, 2008
    Applicant: NXP B.V.
    Inventor: Peter Adrianus Jacbus Dirks